3D Multi-Band Antenna Layout for Thin-Bezel Electronic Housings
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Solution Overview
Problem
In 4G and 5G communications, the design of multi-frequency sub-6G antennas faces challenges due to limited space and the need for a high screen-to-body ratio and thin form factor, resulting in reduced antenna performance and narrow bandwidth.
Innovation Solution
The antenna module incorporates a first radiator and a second radiator, with sub-radiators connected through common feeding structures, disposed on both inner and outer non-metallic surfaces of the device, forming a three-dimensional structure to maximize clearance height and spatial multiplexing, allowing for improved antenna performance and coverage of multiple 5G frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple antennas are used to support MIMO for increased data rate, then communication performance is improved, but device thickness and design space increase
Solution Approach 1:
The patent implements nested antenna structures where radiators are arranged in multiple layers with inner and outer radiators positioned at different depths within the device housing. The first radiator is disposed on an inner side surface while the second radiator is disposed on an outer surface, creating a nested configuration that maximizes spatial utilization without increasing overall device thickness.
Solution Approach 2:
The patent transitions from traditional planar antenna layouts to three-dimensional spatial arrangements by utilizing both inner and outer surfaces of the housing. The first sub-radiator and second sub-radiator are connected through connection portions that extend in multiple dimensions, enabling multi-frequency operation within a compact footprint by exploiting the third dimension (depth/thickness) efficiently.
2Shape
If antenna design space is reduced to achieve high screen-to-body ratio, then device appearance is improved, but antenna performance and bandwidth deteriorate
Solution Approach 1:
The patent compensates for reduced planar antenna space by utilizing vertical dimension and both inner/outer housing surfaces. The multi-layer radiator configuration with connection portions creates effective radiating paths that maintain performance despite reduced footprint, allowing high screen-to-body ratio while preserving antenna functionality.
Solution Approach 2:
The antenna system is segmented into multiple independent radiators (first radiator with first and second sub-radiators, and second radiator) that can be independently optimized for different frequency bands. This segmentation allows each radiator to be carefully designed for maximum efficiency within the constrained space, maintaining overall system performance.
3Reliability
If radiators are disposed on both inner and outer surfaces to maximize spatial multiplexing, then antenna performance is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple radiators and feeding structures into an integrated antenna module. The first connection portion and second connection portion merge the first sub-radiator and second sub-radiator into a cohesive first radiator assembly, while the common feeding structure provides unified excitation, reducing overall system complexity despite the multi-surface configuration.
Solution Approach 2:
The common feeding structure serves multiple radiators across different frequency bands, providing a universal excitation source that simplifies the feeding network. This multi-functional approach allows a single feeding structure to support both the first radiator (with its two sub-radiators) and the second radiator, reducing the number of separate components needed.
Data Source
AI summary
An antenna module of the electronic device includes a first radiator and a second radiator. The first radiator and the second radiator respectively correspond to different communication frequency bands, and the first radiator includes: a first sub-radiator, a second sub-radiator, a first connection portion, and a second connection portion. A common feeding structure is disposed between the first sub-radiator and the second radiator, and the first sub-radiator is connected to the second sub-radiator through the first connection portion and the second connection portion. The common feeding structure and the first sub-radiator are disposed on a non-metallic area of an inner side surface of a housing of the electronic device, the second sub-radiator is disposed on a non-metallic area of an outer surface of the housing, and the second radiator is disposed on a non-metallic area of the inner side surface or a non-metallic area of the outer surface.