3D Multichip Package Layout for Mixed-Thickness Component Integration
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Solution Overview
Problem
Existing multichip packaging technologies face challenges in integrating semiconductor devices and other components with varying footprints and thicknesses in a dense arrangement, often requiring complex substrate modifications and limiting flexibility in component placement.
Innovation Solution
The use of polymeric materials for packaging, combined with redistribution layers and conductive interconnects, allows for the embedding of components at different depths and locations within multiple layers, accommodating components of disparate sizes and thicknesses through adjustable layer thickness and interconnect routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If complex substrate modifications are used to integrate components with varying footprints and thicknesses, then component integration capability is improved, but device complexity increases
Solution Approach 1:
The package structure is divided into multiple redistribution layers (first redistribution layer, second redistribution layer) with distinct functions. The first redistribution layer handles electrical redistribution for components, while the second redistribution layer provides structural support and additional routing. This segmentation allows each layer to be optimized independently for components with varying footprints and thicknesses without requiring complex modifications to a single substrate.
Solution Approach 2:
The patent transitions from traditional 2D substrate planning to a 3D stacked architecture with multiple redistribution layers at different heights. Components with different footprints and thicknesses can be positioned at different vertical levels and horizontal positions, utilizing the third dimension (height) to accommodate dimensional variations without requiring complex substrate modifications.
2Volume of moving object
If components are arranged in a dense configuration to save space, then volume efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The package is segmented into multiple redistribution layers with dedicated routing paths for each layer. This segmentation allows components to be placed in dense configurations at different vertical levels while maintaining adequate routing space and electrical isolation, reducing the precision requirements compared to a single-layer dense arrangement.
Solution Approach 2:
The redistribution layers act as intermediary structures between components with different footprints and thicknesses. These intermediate routing layers provide flexible electrical connections that can accommodate variations in component dimensions and positions, reducing the stringency of placement precision requirements while maintaining dense packaging.
3Ease of manufacture
If components with different thicknesses are integrated in a single plane, then manufacturing simplicity is maintained, but space efficiency deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple redistribution layers at different heights. Components with different thicknesses can be positioned at different vertical levels, allowing the package to achieve high volume efficiency without requiring all components to lie in a single plane. This 3D arrangement maintains manufacturing simplicity while improving space utilization.
Solution Approach 2:
The package structure employs a nested arrangement where components of varying thicknesses are positioned at different vertical levels within the package volume. Thinner components can be placed in regions where taller components do not occupy space, effectively nesting components vertically to maximize volume efficiency while maintaining ease of manufacture through standardized layering processes.
Data Source
AI summary
A package is formed that encapsulates first and second components having respective first and second thickness differing from each other. Each component has lower surface provided with electrical contact pads and an upper surface opposite the lower surface. A volume of molding material encapsulates the first component. The package includes a set redistribution layers including a set of electrically-conductive interconnects surrounded by electrically-insulating material. The redistribution layers are disposed above the upper surface of the first component. The package includes one or more electrically conductive interconnects that pass through the redistribution layers to the lower surface of the first component; The second component is disposes at a location adjacent to the first component. A first portion of the second component is surrounded by the volume of molding material and a second portion of the second component is surrounded by one or more of the redistribution layers.