3D Multi-Layer Electronic Device Production via Segmented Unit Assembly
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Solution Overview
Problem
Existing technologies face challenges in applying prototype modeling techniques to the manufacturing of three-dimensional multi-layer electronic devices, particularly in managing dimensional variations of embedded components and optimizing tact and cycle times.
Innovation Solution
A method involving three-dimensional layout forming to manufacture multi-layer units with embedded electronic components and circuit wiring, followed by a unit layout process where these units are integrated vertically to form a three-dimensional multi-layer electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If full additive method is used to build components in cavities, then manufacturing flexibility is improved, but dimensional control becomes more difficult
Solution Approach 1:
The manufacturing process is divided into two independent stages: (1) forming multi-layer units with embedded components using additive manufacturing, and (2) assembling these pre-formed units into the final three-dimensional device. This segmentation allows dimensional control to be handled during the unit formation stage while maintaining manufacturing flexibility during the additive process, thereby resolving the contradiction between adaptability and precision.
Solution Approach 2:
Electronic components are embedded and circuit wirings are formed within multi-layer units before the final assembly stage. By performing these critical dimensional operations preliminarily during unit formation, the patent ensures precise dimensional control is achieved before units are assembled into the final device, while the additive method maintains flexibility during this preliminary stage.
2Manufacturing precision
If layers are formed sequentially one by one, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The device is divided into multiple multi-layer units that can be formed independently and simultaneously. Each unit maintains precise dimensional control through the additive method, while multiple units are manufactured in parallel rather than sequentially, thereby improving productivity without sacrificing precision.
Solution Approach 2:
Multiple multi-layer units are assembled together in the unit layout process to form the final three-dimensional device. By merging independently formed units, the patent achieves both the precision of individual unit formation and the productivity of parallel manufacturing, resolving the contradiction between sequential precision and overall productivity.
3Manufacturing precision
If components are adjusted one by one according to dimensional variation, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
Dimensional accuracy is ensured during the preliminary unit formation stage through controlled additive manufacturing processes. By establishing precise dimensions during unit creation rather than through subsequent individual adjustments, the patent eliminates time-consuming adjustment operations while maintaining manufacturing precision.
Solution Approach 2:
The patent controls dimensional parameters during the additive manufacturing process of multi-layer units. By adjusting process parameters during formation rather than performing post-formation adjustments, the patent achieves precise dimensional control more efficiently, reducing the time loss associated with individual component adjustments.
Data Source
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AI summary
Disclosed is a method of manufacturing a three-dimensional multi-layer electronic device, the method including: a unit forming process of forming a multi-layer unit including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out and integrating the multi-layer unit in a vertical direction.