3D Optical Coupler Layout for Higher-Density Photonics I/O
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Solution Overview
Problem
Conventional photonic structures face limitations in scalability and data rate due to the limited space for optical fiber coupling and separation, restricting the number of input/output ports and data communication efficiency.
Innovation Solution
A photonic structure with multiple input/output optical couplers featuring mirrors at varying heights and lenses to facilitate a three-dimensional configuration, allowing for increased port density and reduced fiber separation, utilizing interleaved arrangements of spot-size converters and optical couplers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If spot-size converters are used for optical coupling, then light coupling from the light source to the photonic integrated circuit is achieved, but the scalability for increasing the number of optical fibers is limited
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of optical components to a three-dimensional vertical stacking architecture. Multiple spot-size converters and optical couplers are positioned at different heights (z-dimension) above the semiconductor substrate, enabling increased port density without expanding the chip's footprint. This vertical dimensionality change resolves the contradiction by allowing more optical fibers to be coupled while maintaining limited edge space.
2Area of stationary object
If the separation between adjacent optical fibers is reduced, then space efficiency is improved, but the input/output bottleneck restricts the data rate
Solution Approach 1:
By introducing vertical separation between optical couplers at different heights, the patent enables reduced lateral separation between adjacent optical fibers while maintaining adequate isolation through the z-dimension. This three-dimensional arrangement prevents signal interference even when fibers are closely packed horizontally, thereby improving space efficiency without creating an input/output bottleneck that would restrict data rate.
Solution Approach 2:
The patent segments the optical coupling function across multiple vertical layers, with each layer containing dedicated spot-size converters and optical couplers. This segmentation allows independent optimization of each coupling interface and enables parallel data transmission through multiple channels, increasing overall data rate while maintaining compact horizontal spacing.
3Adaptability or versatility
If multiple optical couplers are added to increase port density, then scalability is improved, but the device complexity increases
Solution Approach 1:
The patent employs identical spot-size converter and optical coupler structures repeated across multiple vertical layers, each performing the same optical coupling function. This universal, modular design allows scalability to multiple ports without proportionally increasing device complexity, as each layer uses the same proven components and fabrication processes. The repetitive modular architecture simplifies design and manufacturing while enabling increased port density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the scalability and data rate by expanding the number of input/output ports and reducing spatial constraints, thereby improving communication efficiency with photonics chips.
Implementation Method 1
a first optical coupler including a first mirror disposed at a first height relative to a top surface of the semiconductor substrate and configured to reflect first light from the light source to the photonics chip
Implementation Method 2
a plurality of lenses disposed over a top surface of the semiconductor substrate. The lenses are configured to direct light from the light source to the mirror
Data Source
AI summary
Photonic structures including multiple input/output optical couplers and methods of forming such photonic structures. The photonic structure comprises a light source and a photonics chip including a semiconductor substrate. The photonic structure further comprises a first mirror disposed at a first height relative to a top surface of the semiconductor substrate and a second mirror disposed at a second height relative to the top surface of the semiconductor substrate. The first mirror is configured to reflect first light from the light source to the photonics chip, and the second mirror is configured to reflect second light from the light source to the photonics chip. The first mirror is disposed between the second mirror and the light source, and the second height is different from the first height.