3D Optical Waveguide for Low-Loss PIC Interconnects
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Solution Overview
Problem
Existing optical connection methods for photonic integrated circuits (PICs) face significant optical loss due to the mismatch in size and shape between optical fibers and PIC waveguides, limiting efficient connection and hindering mass production.
Innovation Solution
An optical connection apparatus and method that uses a position fixing portion and an optical-imprinting portion to form a three-dimensional (3D) optical waveguide by interposing an optically imprintable connection member between optical circuits, adjusting the waveguide ends to match the sizes and shapes of the circuits, and using a laser, focusing lens, and controller to vary the refractive index and shape the waveguide for efficient connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a planar optical waveguide is used to connect optical fibers and PICs, then the connection structure is simple, but great optical loss occurs due to size and shape mismatch
Solution Approach 1:
The patent transitions from a planar (2D) optical waveguide to a three-dimensional (3D) optical waveguide. The 3D optical waveguide has a tapered structure that extends in the vertical dimension, allowing it to bridge the size and shape mismatch between optical fibers and PIC waveguides. This dimensional change enables mode field matching while maintaining connection simplicity.
Solution Approach 2:
The patent changes the geometric parameters of the optical waveguide by creating a tapered structure with varying cross-sectional dimensions along its length. The waveguide width and height are gradually changed from one end to the other, enabling smooth mode field transformation and reducing optical loss due to mismatch.
2Productivity
If the optical waveguide size is changed to match optical fibers, then connection efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary action by pre-forming the 3D tapered optical waveguide structure in the connection member before final assembly. The waveguide is created with the appropriate tapered geometry in advance, so that when optical circuits are connected, the size matching is already achieved, improving connection efficiency without increasing assembly precision requirements.
3Loss of energy
If a three-dimensional optical waveguide is formed by optical imprinting, then optical loss is minimized, but the manufacturing process complexity increases
Solution Approach 1:
The patent replaces complex mechanical machining or lithography processes with optical imprinting. A high-energy laser beam is used to directly write and form the 3D tapered optical waveguide structure inside the connection member. This optical manufacturing approach simplifies the production process while achieving the complex 3D geometry needed to minimize optical loss.
Solution Approach 2:
The patent changes the physical state and properties of the connection member material through optical imprinting. The laser beam induces localized refractive index changes or structural transformations in the material, forming the 3D waveguide structure. This parameter change enables simple manufacturing of complex geometries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D optical waveguide effectively minimizes optical loss by matching the end portions of optical circuits, enabling efficient connection and facilitating mass production of low-cost PICs.
Implementation Method 1
an optical-imprinting portion configured to emit light to the connection member to form a three-dimensional (3D) optical waveguide, which connects the optical circuits, in the connection member
Implementation Method 2
a focusing lens through which the light emitted by the laser passes
Data Source
AI summary
An optical connection apparatus includes a position fixing portion configured to fix optical circuits each having a different end portion, while interposing a connection member that is optically imprintable between the optical circuits, and an optical-imprinting portion configured to emit light to the connection member to form a three-dimensional (3D) optical waveguide in the connection member that connects the optical circuits to each other.