3D Orthogonal Superposed Inductor for High Density IC
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Three-dimensional (3D) inductors on integrated circuit chips occupy significant chip real estate and face constraints in spacing and orientation due to magnetic cross-coupling issues, limiting their practical application.
Innovation Solution
The design of 3D orthogonal superposed inductors, where two inductors with orthogonal winding axes intersect within their respective winding sections, allowing for a compact configuration that shares substrate volume while maintaining orthogonal magnetic coupling directions, thereby increasing device density without substantial coupling increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional 3D inductors are used, then inductor performance is improved, but chip real estate is monopolized and device density is reduced
Solution Approach 1:
The patent combines two separate 3D inductor structures into a single shared substrate volume. The first and second inductors are formed within the same substrate region, allowing their winding sections to overlap in the vertical dimension while maintaining orthogonal magnetic coupling directions. This merging approach doubles the effective device density without substantially increasing the occupied chip area.
Solution Approach 2:
The patent utilizes the vertical dimension (z-axis) by forming inductors with winding sections that extend through the substrate thickness. By superposing the winding sections of two inductors in the vertical dimension with orthogonal orientations, the design achieves high device density while minimizing the horizontal footprint on the chip surface.
2Productivity
If 3D inductors are placed adjacent to each other, then device density increases, but cross-coupling between inductors increases due to magnetic field interference
Solution Approach 1:
The patent employs asymmetric orthogonal orientations for the two inductors. The first inductor has a winding axis oriented in a first direction, while the second inductor has a winding axis oriented in a second direction that is orthogonal to the first. This asymmetric orthogonal configuration causes the magnetic coupling directions to be perpendicular, significantly reducing mutual interference and cross-coupling between the adjacent inductors while maintaining high device density.
3Area of stationary object
If stacked 2D spiral inductors are used, then chip area is reduced, but significant cross-coupling occurs due to magnetic field alignment
Solution Approach 1:
The patent transitions from 2D planar spiral inductors to 3D inductors with winding sections that extend through the substrate thickness. By utilizing the vertical dimension and forming orthogonal winding axes in three-dimensional space, the design achieves compact chip area occupation while the orthogonal orientation in the vertical dimension prevents magnetic field alignment that causes cross-coupling in stacked 2D configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a high percentage of volume sharing with only a 30% increase in occupied area, approximately doubling effective device density without significant coupling issues, providing a compact and efficient solution for 3D inductor placement.
Implementation Method 1
the first inductor includes a first coil winding arranged to wind around a winding section of a first winding axis. The second inductor includes a second coil winding arranged to wind around a winding section of a second winding axis
Data Source
AI summary
A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.