3D Package Structure With Substrate Opening for Chip Cooling
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Solution Overview
Problem
The challenge in semiconductor packaging is effectively managing heat dissipation, particularly for chips on the lower substrate in 3D stacked packaging configurations, as excessive heat can damage devices and pose safety hazards.
Innovation Solution
A package structure and manufacturing method that includes a first and second substrate, chips, and a heat sink, where the second substrate has an opening to expose the backside of the first chip, allowing the heat sink to be mounted directly to the first chip through this opening, enhancing heat dissipation, and the substrates are connected via inter-board structures for improved thermal management and increased interconnection density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D stacked packaging is used to increase integration density, then productivity and performance are improved, but heat dissipation becomes more difficult and temperature increases
Solution Approach 1:
The patent introduces a through-opening structure in the lower substrate that extends vertically through the stacked package, creating a new thermal conduction dimension. This allows heat sinks to be positioned at multiple levels (top and bottom) of the chip stack, enabling heat to dissipate in vertical directions rather than being constrained to horizontal planes only.
Solution Approach 2:
The patent introduces heat sinks as intermediary thermal management components that couple between the chips and the external environment. These heat sinks serve as thermal mediators that conduct heat away from the chips through direct thermal contact, with the lower substrate opening providing access for additional heat sink placement to enhance overall heat dissipation capacity.
2Temperature
If heat sinks are added to manage thermal load, then temperature control is improved, but device complexity increases
Solution Approach 1:
The lower substrate serves multiple functions: it provides mechanical support for the chip stack, enables electrical interconnections between chips, and now also provides a through-opening for thermal management. This multi-functionality reduces the need for separate dedicated structures, as the substrate itself becomes part of the thermal conduction pathway.
Solution Approach 2:
The patent merges the structural support function, electrical connection function, and thermal management function into an integrated package structure. The through-opening in the lower substrate combines mechanical integrity with thermal access, eliminating the need for separate cooling channels or structural modifications that would otherwise be required.
3Ease of manufacture
If a single heat sink is used for both chips, then manufacturing cost is reduced, but heat dissipation effectiveness may be compromised
Solution Approach 1:
The thermal management system is segmented into multiple independent heat dissipation paths: one heat sink on the top surface for the upper chip, and another heat sink accessible through the lower substrate opening for the lower chip. This segmentation allows each heat sink to independently manage heat from specific chips, improving overall thermal effectiveness while maintaining cost efficiency through standardized component usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation for both chips, allows for a smaller package size with higher performance, and provides flexible system design by using a single heat sink to dissipate heat generated by both chips, thereby addressing the challenge of heat management in 3D stacked semiconductor packaging.
Implementation Method 1
the heat sink is mounted to the back side of the first chip through the first opening... provides flexible system design by using a single heat sink to dissipate heat generated by both chips
Implementation Method 2
the heat sink is mounted to the back side of the first chip through the first opening... enhancing heat dissipation
Data Source
AI summary
The present disclosure discloses a package structure and a manufacturing method thereof. The package structure includes a first substrate, a second substrate, a first chip, a second chip, a heat sink and inter-board connection structures. The second substrate is provided with a first opening penetrating through an upper surface and a lower surface of the second substrate. The first chip is mounted to an upper surface of the first substrate, and the first chip is electrically connected to the first substrate. The second substrate is mounted to the upper surface of the first substrate. The inter-board connection structures are positioned between the lower surface of the second substrate and the upper surface of the first substrate, and the second substrate is electrically connected to the first substrate through the inter-board connection structures.