3D Package Cooling System with Dynamic Active Control
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Solution Overview
Problem
Conventional heat dissipation techniques in 3D multi-die electronic package modules are inadequate for high-density, high-speed systems, leading to reduced performance and potential early failure due to insufficient heat removal.
Innovation Solution
A method and electronic structure that incorporate active cooling mechanisms, including system-level and package-level cooling systems, controlled by a controller that adjusts cooling based on environmental conditions and workload, using thermoelectric coolers and other active cooling methods to optimize heat removal while minimizing energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If passive cooling provisioning is used, then device complexity is reduced, but heat removal capability is insufficient for high-density, high-speed systems
Solution Approach 1:
The patent implements dynamic cooling control by transitioning from static passive cooling to active cooling mechanisms (such as thermoelectric coolers and liquid cooling systems) that can be adjusted based on real-time thermal conditions and workload requirements. This allows the cooling system to adapt its intensity and distribution dynamically, providing sufficient heat removal capability for high-density systems while maintaining manageable complexity through intelligent control rather than purely passive design
2Reliability
If active cooling mechanisms are added to improve heat removal, then heat removal capability is enhanced, but energy consumption increases
Solution Approach 1:
The patent employs periodic or intermittent activation of active cooling mechanisms rather than continuous operation. The cooling system activates active cooling only when thermal thresholds are exceeded or during high-workload periods, and can reduce or deactivate active cooling during low-thermal-condition periods. This periodic action pattern enables the system to achieve adequate heat removal capability when needed while significantly reducing overall energy consumption compared to continuous active cooling operation
3Productivity
If multiple 3D multi-die electronic package modules are arranged together to increase productivity, then system capacity is enhanced, but heat management complexity increases
Solution Approach 1:
The patent segments the cooling management into modular units, with each 3D multi-die electronic package module equipped with its own dedicated cooling mechanisms (such as individual thermoelectric coolers or localized liquid cooling channels). This segmentation allows each module to be cooled independently and manages heat at the module level rather than requiring complex system-wide heat management, thereby enabling higher system capacity while keeping heat management complexity manageable through modular architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation in 3D packages, ensuring adequate cooling while reducing energy consumption and prolonging the lifespan of high-density electronic components.
Implementation Method 1
actively cooling the die have also been proposed through use of thermoelectric coolers having a P-type material plate and an N-type material plate mounted between various die
Data Source
AI summary
In a method for managing at least one three-dimensional package and a cooling system having at least one active cooling mechanism configured to cool the at least one three-dimensional package, at least one of workload on and an environmental condition on or around the at least one three-dimensional package is identified. In addition, at least one of an active cooling mechanism and a three-dimensional package is controlled based upon at least one of the identified workload and environmental condition.