3D Package Frame Structure for Heat Dissipation and Routing

The patent segments the heat dissipation function from the electrical connection function by introducing separate heat dissipation structures (heat dissipation pads, heat dissipation layers) distinct from the electrical interconnect layers. This allows independent optimization of thermal and electrical pathways, enabling heat to be extracted from each die independently while maintaining the stacked 3D configuration for high circuit density.

The patent introduces intermediary thermal interface materials and heat dissipation structures between the stacked dies and the external heat sink. These intermediaries include thermally conductive encapsulant materials, heat dissipation pads, and thermal vias that facilitate heat transfer from the buried dies through the intermediate layers to the heat sink, resolving the heat dissipation bottleneck in 3D stacked packages.

The patent transitions from planar 2D routing to three-dimensional routing by implementing vertical vias and through-silicon vias (TSVs) that extend connections through multiple stacked layers. This dimensional change allows signals to be routed vertically between dies and horizontally within layers, providing flexible routing paths that reduce complexity compared to trying to route all connections through a single plane.

The patent implements a nested structure where multiple routing layers and interconnect structures are embedded within the stacked die configuration. Each die layer contains its own routing layer, and vertical vias nest through multiple layers to connect corresponding pads across dies, creating a hierarchical routing system that simplifies the overall connection architecture.