3D Package Structure With Metal Lid Interface for Heat Dissipation
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating and connecting multiple semiconductor dies in three-dimensional (3D) packaging structures, leading to issues with thermal management and reliability, particularly in achieving uniform heat dissipation and preventing delamination of thermal interface materials.
Innovation Solution
A method involving the use of a debond layer on a carrier for assembling semiconductor dies, followed by encapsulation and redistribution layers, and the application of a metallic material layer on the packaged devices to enhance thermal management, with a thermal interface material sandwiched between the metal layer and a lid for improved heat dissipation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor dies are integrated in 3D packaging structure, then device functionality and integration density are improved, but thermal management difficulty and reliability issues worsen
Solution Approach 1:
The patent transitions from planar 2D packaging to three-dimensional 3D packaging structure, stacking multiple semiconductor dies vertically to achieve higher integration density. This dimensional change allows more devices to be integrated within the same footprint area, directly improving productivity while introducing thermal management challenges that the subsequent metal layer and thermal interface material solutions address.
Solution Approach 2:
The patent introduces a thermal interface material layer as an intermediary between the metal layer and the semiconductor dies. This intermediary substance facilitates efficient heat transfer from the hot semiconductor dies to the cooling metal layer, resolving the thermal management difficulty that arises from high integration density in 3D packaging.
2Temperature
If thermal interface material is applied to manage heat, then heat dissipation is improved, but delamination of thermal interface material occurs
Solution Approach 1:
The patent employs a composite structure consisting of a metal layer combined with a thermal interface material layer. This composite material system leverages the high thermal conductivity of metal while using the thermal interface material to ensure proper thermal contact and stress distribution, thereby achieving effective heat dissipation while preventing delamination through the synergistic combination of materials with complementary properties.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the thermal interface material and its interface with the metal layer and semiconductor dies. By optimizing parameters such as thermal conductivity, adhesion strength, and coefficient of thermal expansion, the system achieves both effective heat dissipation and prevention of delamination under thermal cycling conditions.
3Reliability
If metallic material layer is applied on packaged devices, then thermal management is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the thermal management function with the existing packaging structure by integrating the metal layer and thermal interface material into the packaging process flow. This merging of thermal management components with the packaging structure achieves effective heat dissipation while minimizing additional manufacturing complexity, as the thermal management features are incorporated into the packaging steps rather than requiring separate complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable integration of multiple semiconductor dies with improved thermal management, preventing delamination and enhancing the overall reliability and performance of the package structure by ensuring uniform heat dissipation and structural integrity.
Implementation Method 1
a thermal interface material sandwiched between the metal layer and a lid for improved heat dissipation
Data Source
AI summary
A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer.