3D Package Structure With Integrated Die Heat-Dissipation Layer
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Solution Overview
Problem
The challenge of effective heat dissipation in semiconductor package systems, particularly in complex 3D System-in-Package (SiP) applications, has not been adequately addressed, given the increasing demand for multifunctionality.
Innovation Solution
A package structure comprising a first substrate, a die, a molding layer, a second substrate, vias, and a heat-dissipation layer, where the heat-dissipation layer is coupled to the die and can be further connected to a heat-dissipation lid, allowing heat generated by the die to be effectively conducted away through these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional semiconductor package structures are used, then device complexity and multifunctionality can be achieved, but heat dissipation becomes inadequate
Solution Approach 1:
The patent introduces a heat dissipation layer positioned between the die and the molding layer, adding a new dimensional approach to thermal management within the existing package structure. This layer creates an additional thermal conduction path that does not interfere with the electrical functionality, allowing heat to be conducted away from the die in a direction perpendicular to the die surface while maintaining all original electrical connections through the molding layer and vias.
Solution Approach 2:
The heat dissipation layer acts as an intermediary component between the heat-generating die and the surrounding package structure. This intermediate layer provides a dedicated thermal conduction pathway, mediating the heat transfer process without interfering with the electrical signals that pass through the molding layer and vias. The intermediary layer thus separates the thermal management function from the electrical interconnection function.
2Temperature
If heat dissipation structures are added to address thermal issues, then thermal management improves, but device complexity increases
Solution Approach 1:
The heat dissipation layer is merged with the existing package structure by positioning it within the molding layer rather than adding it as a separate external component. The molding layer itself serves dual purposes: maintaining structural integrity and providing electrical connections through vias, while also accommodating the heat dissipation layer for thermal management. This merging approach integrates thermal and electrical functions within a unified structure.
Solution Approach 2:
The molding layer is designed to perform multiple functions simultaneously: it provides mechanical support, establishes electrical connections through embedded vias, and accommodates the heat dissipation layer for thermal management. This multi-functional design eliminates the need for separate dedicated components for each function, thereby reducing overall device complexity while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation from the die and any associated active components, enhancing thermal management in semiconductor packages.
Implementation Method 1
heat-dissipation layer is on the back surface of the die... heat generated by the die to be effectively conducted away through these components
Data Source
AI summary
A package structure includes a first substrate, a die, a molding layer, a second substrate, vias, and a heat-dissipation layer. The first substrate has first lower contacts on its lower surface, and the first substrate has first upper contacts on its upper surface and electrically connected to the first lower contacts. A die is electrically connected to the first upper contacts. The molding layer laterally encapsulates the die. The second substrate on the molding layer has second upper contacts on its upper surface, and the second substrate has second lower contacts on its lower surface and electrically connected to the second upper contacts. Each of the vias is in the molding layer to electrically connect the first upper contacts and the second lower contacts. The heat-dissipation layer is on the die. The upper surface of the second substrate is higher or lower than an upper surface of the heat-dissipation layer.