3D Semiconductor Package Heat Sink Layout for Hot Spot Dissipation
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Solution Overview
Problem
Current heat dissipation methods in 3D Integrated Circuits (3DIC) are inadequate for efficiently managing heat generated by device dies, particularly in high-performance computing applications, where heat needs to be dissipated from both semiconductor components and hot spot regions to prevent thermal damage and ensure device longevity.
Innovation Solution
A heat dissipation unit comprising a first heat dissipation component with a through structure and a second heat dissipation component with higher thermal conductivity, attached to the semiconductor package through a thermal interface material, providing enhanced heat dissipation pathways and hot spot region management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single metal lid is used for heat dissipation, then the structure is simple, but the heat dissipation efficiency is insufficient for high-performance computing applications
Solution Approach 1:
The heat dissipation system is divided into multiple components: a first heat dissipation component (metal lid) and a second heat dissipation component (heat sink), each serving specific functions. This segmentation allows optimized heat dissipation pathways for different thermal zones while maintaining manageable structural complexity
Solution Approach 2:
The patent implements localized heat dissipation strategies by positioning the second heat dissipation component specifically over hot spot regions, while the first heat dissipation component covers broader areas. This local quality approach targets high-heat-generation zones with enhanced dissipation capabilities without unnecessarily complicating low-heat regions
2Temperature
If heat dissipation components are added to improve thermal management, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The first and second heat dissipation components are merged into an integrated heat dissipation system where the metal lid and heat sink work together. This merging provides enhanced thermal management through coordinated action of multiple components while presenting a unified structure that manages overall device complexity
Solution Approach 2:
The first heat dissipation component (metal lid) serves dual functions: it acts as a heat dissipation structure and provides mechanical support/stiffening for the semiconductor device. This multi-functionality reduces the need for additional separate components, thereby managing device complexity while maintaining effective heat dissipation
3Temperature
If a dual-component heat dissipation system is implemented, then hot spot region management is improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates a thermal interface material between the semiconductor device and heat dissipation components during the manufacturing process. This preliminary action ensures optimal thermal contact is established before operation, facilitating effective hot spot management while integrating the dual-component system into the existing manufacturing workflow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from semiconductor components, particularly from hot spot regions, ensuring the longevity and performance of 3D semiconductor packages by utilizing a dual-component heat dissipation system with improved thermal conductivity and structural design.
Implementation Method 1
a thermal interface material, wherein the first heat dissipation component is attached to the semiconductor package through the thermal interface material
Implementation Method 2
the first interface material is a phase change material, wherein the first interface material is softer at a first temperature range than at a second temperature range, and the first temperature range is higher than the second temperature range
Implementation Method 3
the second heat dissipation component has better heat conductivity than the first heat dissipation component
Implementation Method 4
A heat sink may be attached to the metal lid to further dissipate the heat conducted to the metal lid
Data Source
AI summary
A 3D semiconductor package provided herein includes a package substrate; a semiconductor package bonded to the package substrate; a heat dissipation unit attached to the semiconductor package, wherein the heat dissipation unit comprises a first heat dissipation component and a second heat dissipation component attached to the first heat dissipation component; and a first interface material disposed between the first heat dissipation component and the second heat dissipation component, wherein the first interface material is a phase change material.