3D Semiconductor Package Layout for Shorter Inter-Stack Links
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Solution Overview
Problem
The integration of increased numbers of application-specific integrated circuits (ASICs) and memories in semiconductor packages to meet high data transmission speed demands poses challenges in integrating more components effectively.
Innovation Solution
A semiconductor package structure with a connection element that electrically connects two electronic components without passing through the substrate, allowing for direct horizontal or oblique connections between functional stacks, thereby reducing transmission paths and optimizing data transmission rates and bandwidths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If increased numbers of ASICs and memories are integrated in semiconductor packages, then data transmission speed demand is met, but device complexity increases making it difficult to integrate more components
Solution Approach 1:
The patent transitions from traditional planar component arrangement to three-dimensional stacked architecture, where functional stacks are arranged vertically over the substrate. This dimensional change enables higher component density without increasing the substrate footprint, resolving the contradiction between meeting transmission speed demands and managing integration complexity.
Solution Approach 2:
The semiconductor package is divided into multiple functional stacks, each containing specific electronic components (ASICs, memories, etc.). This segmentation allows independent optimization and integration of different functional units, making the overall system more manageable despite the increased number of components.
2Ease of manufacture
If traditional substrate-based connections are used, then component integration is straightforward, but transmission paths are long reducing data transmission efficiency
Solution Approach 1:
Connection elements are routed through the substrate in three-dimensional paths, allowing direct connections between components in different functional stacks. This eliminates the need for long surface-level transmission paths while maintaining manufacturing feasibility through standardized substrate through-hole techniques.
3Productivity
If more components are integrated to meet function demands, then data transmission capabilities improve, but area utilization becomes inefficient
Solution Approach 1:
The patent utilizes vertical stacking to arrange multiple functional units above the substrate, transforming the area utilization problem from a two-dimensional constraint to a three-dimensional solution. This enables high component density without proportionally increasing the substrate area.
Data Source
AI summary
A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a surface of the carrier. The second electronic component is disposed over the first electronic component. The third electronic component is spaced apart from the first electronic component and disposed over the surface of the carrier. The fourth electronic component is disposed over the third electronic component. The connection element is electrically connecting the second electronic component to the fourth electronic component.