3D Electronic Package Stacking for Integrated IVR Miniaturization
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Solution Overview
Problem
Existing electronic packages struggle to integrate multiple semiconductor chips and integrated voltage regulators (IVRs) in a compact form, leading to increased size, power consumption, and manufacturing costs, while also compromising electrical performance.
Innovation Solution
The proposed electronic package design involves stacking an electronic structure, which can function as an IVR, on an electronic component, with conductive pillars providing electrical connectivity. This design is manufactured using a method that forms conductors on the electronic body, attaches the electronic structure to the component via conductive bumps and pillars, and encapsulates the structure and pillars with an encapsulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor chips and IVRs are integrated in a compact form, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacking by forming conductive pillars vertically through the package substrate. Multiple electronic structures are stacked at different heights and connected via conductive pillars, enabling compact integration along the vertical dimension while maintaining manufacturing feasibility through standardized pillar formation processes.
2Length of moving object
If IVR is integrated to the lower side of package substrate, then transmission distance is shortened, but available space is reduced
Solution Approach 1:
Instead of placing IVR on the two-dimensional lower side of the package substrate, the patent stacks electronic structures containing IVR functionality vertically above the substrate using conductive pillars. This three-dimensional arrangement shortens signal transmission paths while preserving substrate area for other components.
Solution Approach 2:
The patent embeds conductive pillars within the package substrate and nests electronic structures around and above these pillars. The IVR-containing electronic structures are positioned in the vertical space above the substrate, effectively nesting multiple functional elements within a compact three-dimensional volume.
3Ease of manufacture
If conventional packaging techniques are used, then manufacturing process is simple, but electrical performance is degraded
Solution Approach 1:
The patent pre-forms conductive pillars within the package substrate before mounting electronic structures. This preliminary action establishes precise electrical connection points in advance, ensuring optimal electrical performance while maintaining a straightforward sequential manufacturing process that does not require complex real-time alignment systems.
Data Source
AI summary
An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.