3D Package Lead Structure for Shock-Resistant Vertical Integration
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Solution Overview
Problem
Existing dense interconnection technologies for packaged electronic devices, such as BGA, suffer from reduced reliability due to susceptibility to shock and vibration in industrial and automotive applications, leading to solder joint cracking and other reliability concerns.
Innovation Solution
The use of packaged electronic devices with upwardly and downwardly extending leads, specifically gull wing or J-type leads, that provide vertical integration and structural robustness, allowing for top and bottom connections to other circuits or components, thereby enhancing reliability and functional density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If BGA or through silicon via technologies are used to increase functional density, then the functional density is improved, but the reliability deteriorates due to susceptibility to shock and vibration causing solder joint cracking
Solution Approach 1:
The patent transitions from planar interconnection (BGA) to three-dimensional vertical interconnection using stacked packages with through-package vias. This dimensional change allows functional density to increase vertically while maintaining robust mechanical connections that resist shock and vibration, thereby resolving the contradiction between improved functional density and maintained reliability.
2Productivity
If BGA packages are used to achieve higher functional density, then the functional density is improved, but the reliability worsens due to solder joint cracking under demanding operating conditions
Solution Approach 1:
The patent employs composite interconnection structures combining multiple materials (copper traces, solder, substrate materials) in stacked packages with through-package vias. This composite approach creates robust mechanical and electrical connections that simultaneously achieve high functional density and enhanced reliability under shock and vibration conditions.
3Productivity
If vertical integration is implemented using upwardly and downwardly extending leads, then the functional density is improved, but the device complexity increases
Solution Approach 1:
The patent divides the electronic system into multiple discrete stacked packages, each with standardized upwardly and downwardly extending leads. This segmentation allows complex vertical integration to be achieved through modular assembly rather than monolithic design, thereby improving functional density while managing device complexity through standardization and modularity.
Data Source
AI summary
A packaged electronic device includes a package structure with opposite first and second sides spaced apart from one another along a first direction, and opposite third and fourth sides spaced apart from one another along a second direction, as well as first and second leads. The first lead includes a first portion that extends outward from the third side of the package structure and extends downward toward a plane of the first side and away from a plane of the second side. The second lead includes a first portion that extends outward from the third side of the package structure, and the second lead extends upward toward the plane of the second side and away from the plane of the first side to allow connection to another circuit or component, such as a second packaged electronic device, a passive circuit component, a printed circuit board, etc.