3D Package Structure for Isolated Power Module with Stacked Magnetic Layers
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Solution Overview
Problem
Conventional isolated power module packages are large due to side-by-side placement of the IC die and transformer, and air-cored transformers without magnets are weak in power rating and EMI performance.
Innovation Solution
A 3-D package structure is introduced, featuring a support layer with metal traces, stacked magnetic layers, and an IC die with a voltage regulator, where the magnetic layers are attached to opposite surfaces of the support layer, and the IC die is assembled above one of the magnetic layers, enabling efficient power transmission and EMI reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cored transformers without magnets are used, then device complexity is reduced, but power rating and EMI performance deteriorate
Solution Approach 1:
The patent applies composite materials by combining magnetic layers with the transformer structure. The magnetic layers are integrated into the transformer assembly, creating a composite structure that enhances power rating and EMI performance while maintaining reasonable complexity. This resolves the contradiction by using material composition rather than structural complexity alone.
2Ease of manufacture
If IC die and transformer are placed side by side, then ease of manufacture is improved, but package size increases
Solution Approach 1:
The patent transitions from a planar side-by-side arrangement to a three-dimensional stacked configuration. The IC die, transformer, and magnetic layers are arranged vertically in multiple layers, utilizing the Z-dimension to reduce the footprint area while maintaining manufacturability through standardized stacking and bonding processes.
Solution Approach 2:
The patent implements nesting by placing the IC die above the transformer, with magnetic layers surrounding or adjacent to the transformer windings. This nested vertical arrangement allows components to occupy overlapping projected areas, significantly reducing the overall package footprint while keeping the assembly process manageable.
3Power
If magnetic layers are added to improve transformer performance, then power rating and EMI performance are enhanced, but device complexity increases
Solution Approach 1:
The patent uses composite materials by integrating magnetic layers into the transformer structure. These magnetic layers are bonded to the transformer core or windings, creating a composite assembly that enhances power handling and EMI shielding without requiring completely new transformer designs.
Solution Approach 2:
The patent merges the magnetic layers with the transformer structure into a single integrated assembly. The magnetic layers are combined with the transformer core, windings, and supporting structures, reducing the need for separate components and simplifying the overall device complexity despite the added functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces package size and enhances power throughput and EMI performance by effectively utilizing magnetic layers to improve transformer design, doubling power capacity and attenuating radiation emissions.
Implementation Method 1
a first magnetic layer and a second magnetic layer, attached respectively on a first surface and a second surface of the support layer
Implementation Method 2
a support layer, configured to contain metal traces
Implementation Method 3
an IC die, assembled above the first magnetic layer, the IC die being configured to contain a voltage regulator
Data Source
AI summary
A 3-D package structure for isolated power module is discussed. The package structure has metal trace in a support layer (e.g. a substrate board), which is covered by two magnetic films from both sides, thus an effective transformer is formed. An IC die which contains a voltage regulator is stacked above the support layer, which significantly reduces the package size.