3D Package Structure With Metal Backside Layer for Heat and Delamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating and connecting multiple semiconductor dies in three-dimensional (3D) packaging structures, leading to issues with thermal management and reliability due to delamination of thermal interface materials.
Innovation Solution
A method involving the use of a debond layer on a carrier for assembling semiconductor dies, followed by encapsulation and redistribution layers, and a metallic material layer on the backside of the dies for improved thermal dissipation and attachment to a circuit substrate, with a thermal interface material layer between the metal layer and a lid for enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material is used to attach lid to semiconductor dies, then thermal dissipation is improved, but delamination occurs reducing reliability
Solution Approach 1:
A metallic material layer is introduced as an intermediary between the semiconductor die and the lid. This metal layer serves dual functions: it provides excellent thermal conductivity for heat dissipation while also acting as a mechanically robust bonding surface that prevents delamination. The metallic layer mediates between the thermal management requirement and the structural reliability requirement, eliminating the delamination issue associated with polymeric thermal interface materials.
Solution Approach 2:
The patent changes the material parameter from polymeric thermal interface material to metallic material. This parameter change fundamentally alters both the thermal properties (maintaining good thermal conductivity) and the mechanical properties (providing superior adhesion and delamination resistance). The metallic material's inherent properties of high thermal conductivity combined with strong bonding capability resolve the contradiction between thermal dissipation and reliability.
2Adaptability or versatility
If multiple semiconductor dies are integrated in 3D packaging, then functionality is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent merges the thermal management function with the structural bonding function by using a metallic material layer that simultaneously serves as both the attachment interface for stacking multiple dies and the primary heat dissipation pathway. This consolidation allows efficient heat extraction from multiple stacked dies through the metal layer, which conducts heat laterally to heat sinks or cooling structures, thereby managing thermal loads in 3D packaged devices.
3Temperature
If metallic material layer is added on backside of dies, then thermal dissipation and attachment are improved, but device complexity increases
Solution Approach 1:
The metallic material layer is formed on the backside of the semiconductor die during the wafer fabrication process, before the die is packaged. This preliminary action integrates the thermal management and attachment function into the existing manufacturing flow without requiring additional post-packaging steps. By performing the metal layer deposition earlier in the process, the patent avoids adding significant complexity to the overall device fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the integration and connection of semiconductor dies in 3D packaging, improves thermal management, and addresses delamination issues, resulting in a more reliable package structure with improved heat dissipation and structural integrity.
Implementation Method 1
a metallic material layer on the backside of the dies for improved thermal dissipation
Implementation Method 2
a thermal interface material layer between the metal layer and a lid for enhanced reliability
Data Source
AI summary
A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer.