3D Semiconductor Package Layout for Heat-Stable Power Modules
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Solution Overview
Problem
Semiconductor chips generate high temperature heat during operation, leading to potential malfunctions and the need for improved electrical and structural stability in compact-sized semiconductor packages.
Innovation Solution
A semiconductor package design featuring a power module, connector, and heat radiator on opposite surfaces of a package substrate, with semiconductor chips vertically overlapping the power module and connected through a substrate, and a dielectric layer filling the space between the connection substrate and the chip, enhancing electrical and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor chips are mounted on multi-layered printed circuit boards, then multi-functionality and data transceiving capabilities are improved, but heat generation increases causing overload and malfunctions
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional vertical stacking, where semiconductor chips are arranged in multiple layers and connected through vertical interconnects. This dimensional change allows multiple functional components to coexist in a compact volume while maintaining electrical connectivity, thereby improving multi-functionality without proportionally increasing heat generation density in any single plane.
Solution Approach 2:
The patent divides the semiconductor package into multiple discrete chip layers and interconnect structures. Each layer can be independently designed, mounted, and thermally managed. This segmentation allows heat to be distributed across multiple mounting surfaces and facilitates targeted thermal management strategies for each layer, reducing the risk of overheating while maintaining complex multi-functional capabilities.
2Volume of moving object
If multiple components are integrated in a compact package, then device size is reduced, but electrical properties and structural stability may deteriorate
Solution Approach 1:
The patent utilizes vertical stacking to achieve compact packaging while maintaining electrical integrity. By arranging chips in three-dimensional layers with dedicated vertical interconnect structures, the design reduces the horizontal footprint without compromising electrical properties. The multi-layer architecture provides multiple signal paths and power distribution routes, enhancing reliability through redundancy.
Solution Approach 2:
The patent introduces intermediate substrates and redistribution layers that mediate between the stacked semiconductor chips and external connections. These intermediary structures provide mechanical support, electrical redistribution, and thermal management interfaces, ensuring that the compact stacked architecture maintains robust electrical properties and structural stability despite the high component density.
3Volume of moving object
If multiple components are integrated in a compact package, then device size is reduced, but structural stability may deteriorate
Solution Approach 1:
The patent employs three-dimensional stacking with chips arranged in vertical layers, which reduces the horizontal package footprint while distributing structural loads across multiple bonding interfaces. The vertical architecture provides inherent structural rigidity, and the multiple attachment points across different layers enhance overall package stability despite the compact size.
Solution Approach 2:
The patent utilizes composite structures combining different materials with complementary properties - such as rigid substrates for mechanical support, flexible adhesives for stress absorption, and thermally conductive materials for heat dissipation. These composite materials maintain structural stability in the compact stacked architecture by balancing mechanical strength, thermal management, and stress distribution across the multi-layer assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved electrical properties, compact size, and enhanced thermal radiation efficiency, stabilizing the semiconductor package against overheating.
Implementation Method 1
a first heat radiator on the second surface of the package substrate, the first heat radiator covering the first semiconductor chip
Implementation Method 2
a first dielectric layer in the first opening and filling a space between the first connection substrate and the first semiconductor chip
Data Source
AI summary
A semiconductor package includes a package substrate, a power module on a first surface of the package substrate, a connector on the first surface of the package substrate, the connector being horizontally spaced apart from the power module, a first semiconductor chip on a second surface of the package substrate opposite to the first surface, and a first heat radiator on the second surface of the package substrate, the first heat radiator covering the first semiconductor chip. The first semiconductor chip vertically overlaps the power module, and the first semiconductor chip is electrically connected through the package substrate to the power module.