3D Integrated Package Layout for Stress-Sensitive RF Components
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Solution Overview
Problem
Current package structures for semiconductors are not adequately miniaturized or multi-dimensional to meet the demands of 5G communication and multi-frequency applications, requiring a more compact and integrated design that can accommodate various devices such as large-size inductors and stress-sensitive filters.
Innovation Solution
An integrated package structure is developed, featuring a main substrate with stacked modules, a cavity element, and a large-size device, encapsulated by a plastic package layer with an opening groove for stress relief, and shielded by multiple layers, along with an interposer for electrical connection and EMI shielding, allowing for horizontal arrangement and reduced overall height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If module components are arranged horizontally on the main substrate, then the integration level is improved, but the occupied area increases
Solution Approach 1:
The patent transitions from traditional planar arrangement to three-dimensional stacking, where module components are arranged vertically on the main substrate. This dimensional change allows multiple modules to occupy the same footprint area by utilizing the vertical dimension, thereby improving integration density without increasing the occupied area.
Solution Approach 2:
The patent implements a nested structure where module components are stacked one above another on the main substrate, similar to nested dolls. Each module is positioned in a vertical hierarchy, with upper modules nested above lower modules within the same horizontal footprint, maximizing space utilization and reducing the overall occupied area.
2Volume of moving object
If the package structure is miniaturized, then the device size is reduced, but the stress on cavity elements increases
Solution Approach 1:
The patent extracts the cavity element from the densely stacked module arrangement and positions it separately on the main substrate. This separation removes the cavity element from the high-stress compression zone created by stacked modules, allowing the package to be miniaturized without subjecting the cavity element to excessive stress from overlapping components.
Solution Approach 2:
The patent applies different spatial arrangements to different components: module components are vertically stacked in high-density zones, while cavity elements are positioned in low-stress zones with adequate spacing. This localized quality differentiation allows miniaturization of the overall package while protecting stress-sensitive cavity elements from compression.
3Object-affected harmful factors
If multiple shielding layers are added for EMI protection, then the electromagnetic shielding performance is improved, but the device height increases
Solution Approach 1:
The patent places shielding layers in the horizontal plane between adjacent module components rather than stacking them vertically. By utilizing the horizontal dimension for EMI protection, the shielding functionality is achieved without increasing the vertical height of the device, maintaining a low-profile structure while providing effective electromagnetic interference protection.
Data Source
AI summary
The present invention relates to an integrated package structure. The integrated package structure includes a main substrate, a first module, a second module, a cavity element and a large-size device, wherein the main substrate includes a first surface of the main substrate and a second surface of the main substrate opposite to each other; the first module and the second module are stacked; the first module and the second module which are stacked, the cavity element and the large-size device are horizontally arranged on the first surface of the main substrate, and are respectively electrically connected to the main substrate. Owing to this arrangement, the demand of a current integrated package structure for a further high-density, miniaturized, multi-dimensional and multi-demand layout design can be met.