3D Package Structure with Shielding Layer for EMI Reduction
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Solution Overview
Problem
Conventional three-dimensional package structures for Point-of-Load (POL) converters face challenges such as large surface occupation, electromagnetic interference (EMI), and limited heat-dissipating ability due to devices being packaged on a single horizontal surface, which complicates maintenance and reduces efficiency.
Innovation Solution
A three-dimensional package structure featuring a semiconductor package body with an energy storage element and a shielding layer, where the energy storage element is stacked on the semiconductor package body, and the shielding layer is positioned between the control device and the magnetic body to reduce EMI and enhance heat dissipation, allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If devices are disposed on the same horizontal surface of the substrate, then electrical connection is simplified, but the surface area occupied by devices becomes large
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. The energy storage element is positioned above the substrate in the vertical dimension, while the control device remains on the substrate plane. This dimensional change reduces the horizontal surface area occupied by devices while maintaining electrical connectivity through vertical conductive structures.
2Device complexity
If all devices are packaged on a single package structure, then integration is achieved, but electromagnetic interference occurs between devices
Solution Approach 1:
The patent segments the package structure into distinct functional regions: the substrate plane containing control devices and the vertical space containing the energy storage element. This spatial segmentation separates devices that generate electromagnetic interference (energy storage element) from sensitive control devices, reducing EMI while maintaining integration benefits.
Solution Approach 2:
The patent introduces intermediate structures including conductive shields and grounding elements positioned between the energy storage element and control devices. These intermediaries act as electromagnetic barriers, blocking interference paths while allowing the integrated package structure to function.
3Ease of manufacture
If devices are packaged on a single horizontal surface, then packaging is simplified, but heat dissipation ability is limited
Solution Approach 1:
The patent utilizes the vertical dimension for heat dissipation by positioning the energy storage element above the substrate. This three-dimensional configuration increases the surface area available for heat dissipation and creates additional thermal pathways, improving thermal management compared to planar arrangements.
4Ease of manufacture
If devices are disposed on the same horizontal surface, then manufacturing is simplified, but the package size becomes large
Solution Approach 1:
The patent employs vertical stacking to reduce the horizontal footprint of the package. By placing the energy storage element in the vertical dimension above the substrate rather than alongside other devices on the same plane, the overall package volume is reduced while maintaining manufacturing feasibility through standardized assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively reduces EMI and improves heat dissipation, enabling a smaller package size while maintaining efficient operation, and allows for easier maintenance by separating devices, reducing material waste and improving flexibility in design and arrangement.
Implementation Method 1
The shielding layer is disposed between the control element and at least part of the magnetic body to inhibit or reduce EMI
Data Source
AI summary
A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.