3D Semiconductor Package Stacking for Compact Reliable Integration
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The solution involves a 3D packaging method that combines package-on-package configurations with device stacking within a single substrate, utilizing a conductive structure with substrate top and bottom terminals and interconnects, and a bottom encapsulant to provide protection and electrical coupling, while also using a redistribution layer substrate with photo-definable dielectric materials for reduced thickness and improved integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but package size becomes too large and integration level is low
Solution Approach 1:
The patent implements 3D packaging by stacking multiple electronic components (first electronic component, second electronic component, third electronic component) vertically on the substrate, transitioning from conventional 2D planar packaging to three-dimensional spatial arrangement. This dimensional change enables higher integration density while reducing the horizontal footprint of the package.
Solution Approach 2:
The patent employs nested packaging structures where electronic components are stacked within each other's vertical space. The first electronic component is positioned at a first level, the second electronic component at a second level, and the third electronic component at a third level, with each component nested within the vertical envelope of the package structure, maximizing space utilization.
2Reliability
If conventional packaging structures are used, then manufacturing process simplicity is maintained, but reliability decreases
Solution Approach 1:
The patent divides the electrical interconnection system into multiple independent conductive structures: first conductive structure connecting the substrate to the first electronic component, second conductive structure connecting to the second electronic component, and third conductive structure connecting to the third electronic component. This segmentation provides independent signal paths, reducing interference and improving reliability.
Solution Approach 2:
The substrate serves as an intermediary element that provides mechanical support and electrical interconnection between multiple electronic components. The substrate with its conductive structure acts as a mediator that enables controlled electrical coupling between components while providing structural stability and thermal management.
3Productivity
If traditional packaging methods are used, then cost is reduced, but performance and integration level are low
Solution Approach 1:
The patent merges multiple electronic components (first, second, and third electronic components) into a single integrated package structure on one substrate. This consolidation combines the functional capabilities of multiple components while reducing the need for separate packages and interconnections, thereby increasing integration level and productivity.
Solution Approach 2:
By utilizing vertical stacking in the third dimension, the patent achieves higher integration density without proportionally increasing the manufacturing process complexity. The multi-level arrangement allows more components to be integrated within the same horizontal footprint, improving productivity through enhanced space utilization.
Data Source
AI summary
In one example, a semiconductor device includes a substrate with a top side, a bottom side, and a conductive structure. A first electronic component includes a first side, a second side, and first component terminals adjacent to the first side. The first component terminals face the substrate bottom side and are connected to the conductive structure. A second electronic component comprises a first side, a second side, and second component terminals adjacent to the second electronic component first side. The second electronic component second side is connected to the first electronic component second side with a coupling structure so that the first component terminals and the second component terminals face opposite directions. Interconnects are connected to the conductive structure. The second component terminals and the interconnects are configured for connecting to a next level assembly. Other examples and related methods are also disclosed herein.