3D PCB Module Layout for Compact Antenna Shielding

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Solution Overview

Problem

Existing electronic modules have a high footprint due to the presence of antennas and high mutual electromagnetic interference between integrated circuits and antennas, especially when operating at different frequencies.

Innovation Solution

The electronic module incorporates a three-dimensional frame with a printed circuit board that has support portions extending transversely in space, allowing electronic devices to be arranged in a non-planar configuration, reducing footprint, and incorporating a material for electromagnetic shielding to minimize interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a planar package configuration is used to arrange electronic devices, then the layout is simple and manufacturing is easier, but the footprint and area occupation become very high

Engineering Contradiction:

Improvelayout simplicityVSAvoidfootprint

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional planar arrangement to a three-dimensional spatial configuration by extending support portions vertically and arranging electronic devices at different heights and orientations. This dimensional change allows the module to maintain compact footprint while accommodating all components including antennas, integrated circuits, and sensors in a stacked and distributed three-dimensional layout.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If antennas are included in the electronic module for wireless communication, then communication functionality is enabled, but the footprint and area occupation increase significantly

Engineering Contradiction:

Improvewireless communication capabilityVSAvoidfootprint

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

Antennas are positioned in three-dimensional space extending from the package, utilizing vertical and lateral dimensions rather than occupying only the planar surface. This allows wireless communication functionality to be integrated without proportionally increasing the module's footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent integrates antennas within and around the package structure, nesting them among other electronic devices and within the housing. This nested arrangement allows multiple components including antennas to share the same spatial envelope, reducing overall footprint while maintaining full functionality.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Area of stationary object

If integrated circuits and antennas are placed close together to reduce footprint, then area occupation decreases, but mutual electromagnetic interference increases

Engineering Contradiction:

ImprovefootprintVSAvoidelectromagnetic interference

Core Design Contradiction:

Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The patent applies electromagnetic shielding materials selectively in specific regions where integrated circuits and antennas are in close proximity. This localized shielding approach targets the harmful electromagnetic interference between these components while maintaining compact overall dimensions, rather than uniformly increasing spacing or adding comprehensive shielding that would enlarge the footprint.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the overall area occupation of the electronic module, lowers mutual electromagnetic interference, and allows for a more efficient use of space and materials, enhancing the module's performance and manufacturing cost-effectiveness.

Implementation Method 1

a three-dimensional frame (12; 112; 212; 312; 412; 512); a printed circuit board (15; 215) fixed to the three-dimensional frame and including a plurality of support portions (37A-37F; 237A-237H) extending transversely to each other in space

Methodology Applied

Scientific EffectThree-dimensional spatial arrangement:

Implementation Method 2

incorporating a material for electromagnetic shielding to minimize interference

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS12349302B2Electronic module carrying a plurality of electronic devices

Publication Date: 2025.07.01 STMICROELECTRONICS SRL

AI summary

The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.