3D PCB Edge Interconnects for Signal Integrity

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Solution Overview

Problem

Existing RAM module PCB connections using conductive pins and vias introduce signal integrity and power integrity issues due to increased electrical pathway length, discontinuities, and transmission line losses.

Innovation Solution

A three-dimensional printed circuit board interface is implemented, where landing pads on one PCB electrically couple to conductive pins or landing pads on another PCB, reducing signal path length and enhancing contact density, signal integrity, and power integrity by using edge-to-edge or edge-to-surface connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive pins and vias are used to connect PCBs, then electrical connection between PCBs is achieved, but signal integrity and power integrity deteriorate due to increased pathway length and discontinuities

Engineering Contradiction:

Improvesignal integrityVSAvoidelectrical pathway length

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent transitions from traditional planar (2D) PCB connections to three-dimensional (3D) vertical connections. Landing pads are disposed on vertical edges of PCBs, enabling edge-to-edge or edge-to-surface connections that reduce electrical pathway length by eliminating the need for conductive pins and vias, thereby improving signal integrity while reducing connection length

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If conductive pins are used for PCB connection, then electrical connection is established, but transmission line losses and crosstalk increase

Engineering Contradiction:

Improvepower integrityVSAvoidtransmission line losses

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes the intermediate conductive pins and vias from the connection path between PCBs. By directly connecting landing pads on vertical edges through edge-to-edge or edge-to-surface interfaces, the harmful transmission line losses and crosstalk associated with pin-based connections are eliminated, improving power integrity

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If traditional PCB connection methods are used, then manufacturing simplicity is maintained, but contact density and signal integrity are compromised

Engineering Contradiction:

Improvecontact densityVSAvoidconnection structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent utilizes the vertical dimension by disposing landing pads on the vertical edges of PCBs rather than only on top or bottom surfaces. This 3D arrangement increases contact density by enabling multiple landing pads to be positioned along the edge, improving signal integrity without significantly complicating the manufacturing process

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10617000B2Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards

Publication Date: 2020.04.07 INTEL CORP

AI summary

A system for a three-dimensional (“3D”) printed circuit board (“PCB”) to printed circuit board interface is provided. A first PCB includes first landing pads disposed on one or more edges of the first PCB. The first landing pads electrically couple to conductive pins or second landing pads disposed on a second PCB. The second landing pads may be disposed in a slot in the second PCB. The interface between the first landing pads and the second landing pads may provide various advantages over traditional PCB to PCB interfaces, such as, improved signal integrity, improved power integrity, increased contact density, decreased clock jitter, etc.