3D PCB Module With Molded Interconnects to Eliminate Solder Resistance
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Solution Overview
Problem
Current 3D circuit modules face challenges in miniaturization due to increased area consumption and high solder joint resistance, limiting the integration of components and system efficiency.
Innovation Solution
A three-dimensional circuit module design that integrates multiple printed-circuit boards (PCBs) on different faces with integrated solidified molding structures, utilizing conductive and insulating materials, and avoiding solder joints to reduce resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If PCB size is increased to accommodate more circuit structures, then the number of circuit components can be increased, but the area consumption increases which is not conducive to miniaturization
Solution Approach 1:
The patent transitions from two-dimensional PCB layout to three-dimensional circuit module architecture by arranging PCBs vertically and connecting them through side-facing circuit assemblies. This dimensional change allows more components to be integrated without increasing the horizontal PCB area, directly resolving the contradiction between component quantity and area consumption.
2Reliability
If different PCBs are spliced by soldering to realize connection, then the 3D circuit structure can be formed, but the resistance of solder joints is relatively large which reduces system efficiency
Solution Approach 1:
The patent extracts and eliminates the soldering process from the connection method between PCBs. By using direct mechanical and electrical connection structures (such as conductive posts and integrated circuit assemblies) instead of solder joints, the invention removes the source of high resistance while maintaining connection reliability, thus resolving the contradiction between reliability and energy loss.
3Area of stationary object
If more PCBs are integrated in three-dimensional structure, then the effective surface area of the circuit is increased, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple PCBs and circuit assemblies into an integrated three-dimensional module structure. By combining support boards, circuit assemblies, and connection structures into a unified design with standardized interfaces and modular components, the invention increases effective surface area while controlling structural complexity through systematic integration rather than ad-hoc assembly.
Data Source
AI summary
A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.