3D PCB Assembly Using SMT Tape-and-Reel Placement
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Solution Overview
Problem
Existing techniques for creating 3D shaped PCBs result in low circuit density and high production costs, necessitating planar components to be placed far from non-planar parts, impacting product size and cost-effectiveness.
Innovation Solution
A method involving manufacturing multiple PCB pieces on a single board, separating them, and affixing them to a main PCB using reflow soldering or gluing, facilitated by a tape and reel assembly in an SMT system, allowing 3D structures to be assembled with standard SMT equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If planar components are placed far from non-planar parts to accommodate 3D structures, then manufacturing feasibility is improved, but circuit density decreases and product size increases
Solution Approach 1:
The PCB is divided into multiple separate pieces that can be independently manufactured and then assembled together. This allows each piece to be optimized for its specific function without compromising overall circuit density, as components can be placed optimally on each segment rather than being forced away from 3D structures across the entire board.
Solution Approach 2:
Multiple PCB pieces are nested within a single tape and reel assembly, allowing them to be handled and placed together as a unit. This nesting approach enables efficient use of space during assembly while maintaining the ability to place components densely on each individual PCB piece.
2Shape
If existing 3D PCB techniques are used, then 3D structures can be formed, but production cost increases significantly
Solution Approach 1:
By segmenting the PCB into multiple pieces that can be manufactured using standard processes and then assembled together, the invention avoids the need for expensive specialized equipment and complex multi-step manufacturing processes required by traditional 3D PCB techniques, significantly reducing production costs.
Solution Approach 2:
The invention merges the manufacturing of multiple PCB pieces with standard SMT assembly processes. By using the same tape and reel assembly infrastructure and SMT placement equipment for both planar and 3D components, the system eliminates the need for separate, expensive manufacturing lines, thereby reducing overall production cost.
3Shape
If 3D shaped PCB parts are created using current technology, then non-planar structures are achieved, but the overall product size increases
Solution Approach 1:
The PCB is segmented into multiple pieces that can be optimally configured for their specific functions. This segmentation allows 3D structures to be created only where necessary rather than across the entire board, minimizing the overall volume occupied by non-planar elements while maintaining the required functionality.
Solution Approach 2:
The invention transitions from a single-planar PCB to a multi-dimensional assembly by stacking multiple PCB pieces at different heights and positions. This dimensional change allows 3D structures to be achieved through strategic placement of PCB pieces rather than through complex single-board 3D forming processes, optimizing space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of 3D structures in PCBs without sacrificing circuit density or increasing costs, suitable for high-volume production.
Implementation Method 1
processing the main PCB via reflow soldering
Implementation Method 2
gluing the one or more placed PCB pieces to the main PCB
Data Source
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AI summary
A technique for creating a printed circuit board (PCB) with 3D structure entails Manufacturing a main PCB and a plurality of PCB pieces. The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. The tape and reel placement machine may also contain a tape loaded with other SMTs, which may be affixed to the main PC.