3D Phase Change Cross-Point Memory Lithography Reduction

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Solution Overview

Problem

The manufacturing of 3D cross-point memories is hindered by the high number of critical lithography steps required, which increases costs and limits scalability, despite the need for higher memory capacity in integrated circuit memories.

Innovation Solution

A method for manufacturing 3D cross-point memories that reduces the number of lithography steps by using sacrificial materials and a tri-layer resist process, allowing for the formation of memory pillars with fewer fabrication steps and lower costs per layer, while maintaining high scalability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple critical lithography steps are used for each memory layer, then manufacturing precision is improved, but manufacturing cost increases and scalability deteriorates

Engineering Contradiction:
Improvelithography precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by forming sacrificial material structures (mandrels) in advance before the actual memory layer fabrication. These pre-formed sacrificial structures serve as templates that guide subsequent lithography steps, allowing multiple memory layers to be fabricated with fewer critical lithography steps per layer. The sacrificial materials are deposited and patterned beforehand, creating a framework that enables self-aligned formation of access lines and memory elements across multiple layers without requiring separate high-precision lithography for each layer.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses sacrificial materials as intermediary elements that facilitate the fabrication process. These intermediary sacrificial structures (formed from materials like silicon oxide, silicon nitride, or silicon carbide) act as temporary templates during manufacturing. They enable the formation of complex 3D cross-point structures by serving as guiding frameworks during deposition and etching processes, and are removed afterward. This intermediary approach allows achieving high manufacturing precision with reduced lithography complexity and cost.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If the number of lithography steps is reduced, then manufacturing cost decreases and scalability improves, but manufacturing precision may deteriorate

Engineering Contradiction:
Improvemanufacturing costVSAvoidlithography precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

By performing preliminary patterning of sacrificial materials before memory layer fabrication, the patent establishes precise geometric templates in advance. These pre-formed sacrificial structures define the exact positions and dimensions of future memory elements, ensuring manufacturing precision is maintained even though fewer critical lithography steps are performed during the actual memory layer formation process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The sacrificial material structures provide self-alignment functionality, where the pre-formed templates automatically guide the formation of subsequent layers without requiring additional high-precision alignment steps. The geometry of the sacrificial materials themselves serves as the reference framework, enabling self-aligned deposition and etching processes that maintain precision while reducing the number of lithography operations needed.

Inventive Principle:
Principle #25Self-service

3Quantity of substance

If more memory layers are stacked, then memory capacity increases, but the number of critical lithography steps multiplies and manufacturing complexity increases

Engineering Contradiction:
Improvememory capacityVSAvoidmanufacturing complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent segments the fabrication process into distinct phases: first forming sacrificial material templates, then using these templates to guide memory layer formation. This segmentation allows the complex task of fabricating multiple memory layers to be broken down into reusable sequence of operations. The sacrificial structures serve as segment-specific templates that can be systematically removed and replaced as each memory layer is completed, reducing overall manufacturing complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By pre-forming the sacrificial material framework before stacking multiple memory layers, the patent creates a reusable template system that simplifies the fabrication of each additional layer. Instead of performing complete high-precision lithography for each layer, the pre-established sacrificial structures guide the formation of subsequent layers, allowing memory capacity to scale with layer count while keeping manufacturing complexity manageable through repeated use of the same template-based approach.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach enables the fabrication of 3D cross-point memories with a reduced number of lithography steps, decreasing fabrication costs and enhancing scalability, thus addressing the challenge of increasing memory capacity while meeting data retention requirements.

Implementation Method 1

programmable memory element comprising a phase change material

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS10950786B2Layer cost scalable 3D phase change cross-point memory
Publication Date: 2021.03.16 MACRONIX INTERNATIONAL CO LTD
  • US10950786B2 patent drawing
  • US10950786B2 patent drawing
  • US10950786B2 patent drawing

AI summary

A 3D memory includes a plurality of first access line levels, a plurality of second access line levels and a plurality of memory cell levels, the memory cell levels being disposed between corresponding first access line levels and second access line levels. The first access line levels include a plurality of first access lines extending in a first direction, and a plurality of remnants of a first sacrificial material disposed between the first access lines. The second access line levels include a plurality of second access lines extending in a second direction and a plurality of remnants of a second sacrificial material disposed between the second access lines. The memory cell levels include an array of memory pillars disposed in the cross-points between the first access lines and the second access lines in adjacent first and second access line levels.