3D Photonic Package Integration for Low-Loss Optical-Electrical Routing
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Solution Overview
Problem
Current photonic semiconductor devices face challenges in efficiently integrating optical and electrical components for high-speed signal transmission and processing, particularly in achieving reliable and efficient conversion between optical and electrical signals while maintaining low signal loss and high-speed performance.
Innovation Solution
The development of a 3D package structure that includes both optical and electrical devices, utilizing a waveguide structure with embedded interconnect devices and an interposer structure made of composite materials for improved high-speed transmission, along with dielectric-to-dielectric bonding for reduced size and increased optical coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical and electrical components are integrated in separate packages, then each component can be optimized independently, but the system size increases and signal transmission efficiency decreases
Solution Approach 1:
The patent integrates optical components (waveguides, photodetectors, lasers) and electrical components (transistors, interconnects) onto a single semiconductor substrate, creating a unified photonic-electronic integrated device. This merging eliminates the need for separate optical and electrical packages, reducing overall system volume while enabling direct optical-to-electrical signal conversion within the integrated structure, thereby maintaining signal transmission efficiency.
Solution Approach 2:
The patent employs three-dimensional vertical stacking of functional layers within the integrated substrate, with waveguides, photodetectors, and electrical interconnects arranged in different vertical planes. This dimensional organization allows dense integration of optical and electrical components without lateral interference, reducing the footprint while preserving signal integrity through optimized vertical coupling paths.
2Ease of manufacture
If conventional packaging methods are used for photonic devices, then manufacturing processes are simple, but optical coupling efficiency is low and device size is large
Solution Approach 1:
The patent combines waveguide structures and electrical interconnect structures into a single integrated substrate using unified semiconductor manufacturing processes. The waveguides and interconnects are formed simultaneously or in sequence using standard lithography, etching, and deposition techniques, maintaining manufacturing simplicity while achieving precise spatial alignment that maximizes optical coupling efficiency between components.
Solution Approach 2:
The patent modifies material parameters and structural dimensions during fabrication to optimize optical coupling. Specifically, the waveguide dimensions, refractive index profiles, and coupling gap distances are precisely controlled through deposition thickness parameters and etch depth parameters, enabling high coupling efficiency to be achieved through standard manufacturing processes without requiring complex post-fabrication alignment.
3Loss of energy
If signal transmission uses electrical signals only, then processing is simple, but signal loss increases and transmission speed is limited
Solution Approach 1:
The patent introduces optical waveguides as intermediary structures that carry optical signals between photodetectors and external interfaces. The waveguides enable low-loss optical signal transmission over longer distances within the integrated device, reducing the need for repeated electrical signal conversion and retransmission. This intermediary optical transmission path lowers energy loss while the integrated photodetectors handle the conversion to electrical signals only where needed, maintaining processing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient conversion and transmission of signals with reduced signal loss and improved high-speed performance, allowing for the integration of photonic packages with processing dies and memory dies on a single interposer structure, reducing system size and cost while enhancing optical communication capabilities.
Implementation Method 1
a waveguide structure with embedded interconnect devices
Implementation Method 2
conversion between optical signals and electrical signals
Data Source
AI summary
A package includes an interposer structure including a first via; a first interconnect device including conductive routing and which is free of active devices; an encapsulant surrounding the first via and the first interconnect device; and a first interconnect structure over the encapsulant and connected to the first via and the first interconnect device; a first semiconductor die bonded to the first interconnect structure and electrically connected to the first interconnect device; and a first photonic package bonded to the first interconnect structure and electrically connected to the first semiconductor die through the first interconnect device, wherein the first photonic package includes a photonic routing structure including a waveguide on a substrate; a second interconnect structure over the photonic routing structure, the second interconnect structure including conductive features and dielectric layers; and an electronic die bonded to and electrically connected to the second interconnect structure.