3D Stacked Photonic Integration With Hybrid-Bonded Waveguide Alignment
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Solution Overview
Problem
Existing photonic devices require large areas for waveguide routing to optical connectors, leading to high costs and inefficiencies in thermal management, and existing 3-D semiconductor die stacking methods lack precise alignment and integration of optically active regions with optical waveguides.
Innovation Solution
Hybrid bonding technology is used to precisely align and integrate optically active photonic devices with optical waveguides in a 3-D stacked configuration, achieving sub-micron alignment accuracy and enabling dense electrical and optical connections across the interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If photonic devices use traditional 2-D layout with waveguide routing to optical connectors, then device functionality is achieved, but device area and cost increase significantly
Solution Approach 1:
The patent transitions from traditional 2-D planar waveguide routing to 3-D vertical stacking architecture. Optical waveguides are routed vertically through the substrate thickness, enabling direct connection between optically active regions on different layers and optical connectors, thereby reducing the lateral footprint and improving routing efficiency simultaneously.
2Manufacturing precision
If existing 3-D semiconductor die stacking methods are used, then vertical integration is achieved, but alignment precision between optically active regions and optical waveguides is insufficient
Solution Approach 1:
The patent segments the photonic device into multiple independently fabricated substrates or layers, each containing specific photonic components. These segmented layers are then vertically stacked and bonded together, allowing precise alignment of optically active regions with optical waveguides at each interface while maintaining manufacturing feasibility.
3Area of moving object
If photonic devices are integrated in a 3-D stacked configuration, then space requirements are reduced, but thermal management challenges increase
Solution Approach 1:
The patent implements localized thermal management solutions at specific hot spots within the 3-D stacked photonic device. Thermal vias, heat sinks, or thermoelectric coolers are strategically placed at interfaces and regions with high power density to efficiently conduct heat away from critical optically active regions, maintaining local thermal balance despite the compact 3-D architecture.
Data Source
AI summary
Apparatus and methods of manufacture are disclosed. In one example the apparatus includes a first substrate that has a first surface, a first optical waveguide that is at or near the first surface of the first substrate, a second substrate that has a second surface. The second substrate is coupled to the first substrate at an interface. The apparatus also has a photonic integrated circuit (PIC) with a portion at or near the second surface. The PIC is in alignment with and optically coupled to the first optical waveguide across the interface.