3D Power Converter With Flexible Substrates
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Solution Overview
Problem
Conventional power converters have limited power density and thermal performance, which are inadequate for meeting the increasing demands of high-performance integrated circuits due to their planar design, leading to poor thermal dissipation and electromagnetic compatibility.
Innovation Solution
A 3D power converter design featuring a rigid bottom substrate connected to multiple side substrates via flexible substrates, forming an angle, which allows for increased surface area utilization and efficient heat dissipation through a heat spreader embedded between the substrates, enhancing power density and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar design is used for power converters, then the structure is simple and easy to manufacture, but the power density and thermal performance are limited
Solution Approach 1:
The patent transitions from a traditional planar 2D layout to a 3D stacked architecture where power converter modules are vertically arranged on the circuit board. Multiple substrates (first substrate, second substrate, third substrate) are stacked in the vertical dimension, allowing more components to be integrated within the same footprint area, thereby significantly increasing power density without complicating the manufacturing process
2Ease of manufacture
If a planar design is used for power converters, then the manufacturing process is simple, but thermal dissipation performance is poor
Solution Approach 1:
The patent introduces vertical heat dissipation pathways by stacking multiple substrates and incorporating heat dissipation structures in the third dimension. The heat dissipation structure extends vertically across multiple substrate layers, providing direct thermal conduction paths from power components to the heat dissipation structure, thereby improving thermal performance while maintaining simple manufacturing processes
Solution Approach 2:
The patent introduces a dedicated heat dissipation structure that acts as an intermediary between power-generating components and the external environment. This heat dissipation structure serves as a thermal bridge, efficiently conducting heat away from the power converter modules through its extended vertical geometry, thereby resolving the thermal dissipation issue without affecting manufacturing simplicity
3Power
If more components are integrated to increase power density, then the power output increases, but the system size increases
Solution Approach 1:
The patent utilizes vertical stacking to integrate multiple power converter modules within the same planar footprint. By arranging components in the vertical dimension rather than spreading them horizontally, the system achieves higher power output without proportionally increasing the overall system volume, effectively decoupling power density from system size
4Reliability
If substrates are connected rigidly, then the electrical connection is stable, but the structure cannot accommodate thermal expansion and assembly tolerances
Solution Approach 1:
The patent employs flexible substrates (such as FPCB - Flexible Printed Circuit Board) to connect the stacked rigid substrates. These flexible interconnection layers can bend and deform to accommodate thermal expansion differences and assembly tolerances between rigid components, while still maintaining reliable electrical connections. This combination of rigid and flexible elements resolves the contradiction between connection stability and structural adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D design significantly increases power density and improves thermal performance by accommodating more components per surface area and efficient heat dissipation, reducing the system size and preventing overheating, while maintaining reliability through precise interconnections and redundant paths.
Implementation Method 1
A heat spreader is embedded in space formed by the bottom substrate and the side substrates to dissipate heat to outside of the power converter
Implementation Method 2
The heat spreader is embedded between the two side substrates and has a surface that forms part of the housing exposing to an outside of the power converter for dissipating heat
Data Source
AI summary
Example embodiment is a power converter that adopt a 3D structure to increase the power density and improve thermal performance. The power converter includes a bottom substrate and at least one side substrate. Both the bottom substrate and the side substrate are rigid. Each side substrate is connected with the bottom substrate by a flexible substrate and forms an angle with the bottom substrate. The bottom substrate is further electrically connected with a plurality of surface mounting devices which are rigid. The flexible substrate provides electrical connection between the bottom substrate and the side substrate.