3D Power Module Stacking With Dual-Sided Die Cooling
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Solution Overview
Problem
Traditional power modules have large package sizes, low power densities, high parasitic inductances, and high power losses due to limited cooling capabilities, which restrict their efficiency and reliability.
Innovation Solution
The implementation of a 3-D stacked power module structure with dual-sided cooling, featuring a heat pipe integrated between semiconductor dies and a cold plate or heat sink, which facilitates active and passive thermal management, reducing parasitic inductance and losses while increasing power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional power module packaging is used, then manufacturing simplicity is maintained, but package size becomes large and power density becomes low
Solution Approach 1:
The patent transitions from traditional planar power module layout to a three-dimensional stacked architecture. Multiple semiconductor dies are vertically stacked with intermediate substrates, allowing compact integration while maintaining electrical functionality. This dimensional change enables high power density without excessive manufacturing complexity.
Solution Approach 2:
The patent implements nested cooling structures where heat pipes are integrated within the stacked die configuration. The heat pipes are positioned between and around the semiconductor dies, creating a nested thermal management system that efficiently removes heat from multiple dies simultaneously while maintaining compact overall dimensions.
2Temperature
If traditional cooling methods are used, then cooling capability is limited, but thermal management effectiveness becomes insufficient
Solution Approach 1:
The patent introduces heat pipes as intermediary thermal management components between the semiconductor dies and the external cooling system. These heat pipes act as thermal conductors that efficiently transfer heat from multiple dies through intermediate substrates, significantly improving thermal management effectiveness and reducing power losses associated with excessive heat generation.
Solution Approach 2:
The patent employs liquid-cooled heat pipes with working fluid circulation to enhance thermal management. The hydraulic cooling system flows coolant through channels in the intermediate substrates and heat pipes, providing active thermal management that effectively removes heat from high-power semiconductor dies and reduces energy losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3-D stacked power module design achieves compactness, low parasitic inductance, low parasitic resistance, and reduced power losses, enhancing thermal management and reliability by utilizing heat pipes as thermal terminals analogous to electrical terminals.
Implementation Method 1
The first heat pipe extends at least partially into the first center spacer layer
Implementation Method 2
The first heat pipe includes: a wick structure disposed between the first semiconductor die and the second semiconductor die; and a vapor chamber disposed at least partially between the first semiconductor die and the second semiconductor die
Implementation Method 3
The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers
Data Source
AI summary
A power module is provided and includes first stack, second stack, and third stacks of layers, a heat pipe, and at least one cold plate or heat sink. The third stack of layers is disposed between the first and second stacks of layers and includes a first semiconductor die, a second semiconductor die and a center spacer layer disposed between the first semiconductor die and the second semiconductor die. The heat pipe extends at least partially into the center spacer layer. The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers. The first stack of layers, the second stack of layers, the third stack of layers, the heat pipe and the at least one cold plate or heat sink facilitate dual sided cooling of each of the first semiconductor die and the second semiconductor die.