3D Functional Print Pattern Deposition for Uniform EMI Shielding
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Solution Overview
Problem
Existing additive printing methods for three-dimensional objects, such as SIP modules, face challenges in achieving uniform and homogeneous layer thickness, which is critical for functional print patterns, particularly for electromagnetic interference shielding, while also requiring high throughput and efficient use of materials.
Innovation Solution
The method involves generating three-dimensional geometrical surface data of the object, projecting it onto a non-parallel print nozzle plane to correct distortions, determining the amount of printing fluid based on layer thickness and movement characteristics, and using a print head with multiple nozzles arranged in a non-parallel plane to achieve uniform layer deposition, with optional curing of the printed pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal housing is used for EMI shielding, then electromagnetic interference shielding is effective, but the device size increases and miniaturization objective is counteracted
Solution Approach 1:
The patent applies a thin functional layer (flexible film) deposited on the SIP module surface to provide EMI shielding, replacing the traditional metal housing. This thin film approach maintains shielding effectiveness while enabling device miniaturization by eliminating the need for bulky metal enclosures.
Solution Approach 2:
The patent extracts the shielding function from the metal housing structure and applies it directly as a thin functional layer on the SIP module surface. This separation allows the shielding function to be implemented independently without requiring a full metal housing, thus reducing overall device volume.
2Volume of moving object
If inkjet printing is used to deposit functional layer, then device miniaturization is supported, but uniform and homogeneous layer thickness is difficult to achieve
Solution Approach 1:
The patent employs a dynamic printing system where the print head and SIP module move relative to each other during the printing process. This dynamic approach, combined with real-time control of printing parameters, enables precise deposition of uniform functional layers while maintaining high throughput and supporting device miniaturization.
3Manufacturing precision
If PVD process is used to apply functional layer, then layer uniformity can be achieved, but the process is complex and time-consuming
Solution Approach 1:
The patent replaces the complex PVD (physical vapor deposition) process with inkjet printing technology. This substitution maintains the ability to achieve uniform functional layers while dramatically simplifying the process and increasing throughput, as inkjet printing is a more direct and controllable deposition method compared to PVD.
Solution Approach 2:
The patent optimizes printing parameters such as printing speed, nozzle-to-surface distance, and ink formulation to achieve uniform layer deposition. By carefully controlling these parameters, the inkjet process can produce consistent functional layers with throughput superior to PVD methods.
4Productivity
If inkjet printing parameters are not optimized, then printing speed can be increased, but layer thickness uniformity and homogeneity deteriorate
Solution Approach 1:
The patent implements a feedback control system that monitors and adjusts printing parameters in real-time based on the actual deposition conditions. This feedback mechanism allows the system to maintain optimal printing speed while ensuring uniform and homogeneous layer thickness, as the system can dynamically compensate for variations in the printing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the deposition of functional layers with precise control over thickness and uniformity, enabling effective electromagnetic interference shielding and adaptable properties for user requirements, while maintaining high throughput and structural homogeneity.
Implementation Method 1
a silver-containing inkjet ink can be deposited on the surface of a SIP module using an inkjet printer
Implementation Method 2
the inkjet ink is cured using, for example, ultraviolet (UV) light in order to form a continuous functional layer on the surface of the SIP module
Implementation Method 3
Prior to the printing process, the surface of the SIP module may undergo a pretreatment process for cleaning purposes. Again, plasma may be used to this end
Data Source
AI summary
An additive printing method depositing a functional print pattern on a surface of a 3D object, an associated computer program, and a computer-readable medium storing the program. The method comprises as steps (i) providing the object on a planar surface; (ii) providing a print head having print nozzles defining a plane non-parallel to the planar surface; (iii) generating 3D geometrical surface data of an exposed surface of the object on the planar surface; (iv) generating 2D geometrical surface data of the exposed surface on the basis of the 3D geometrical surface data; (v) determining an amount of printing fluid to be discharged at a discharge time from each of the print nozzles; (vi) generating a relative movement between the object and the print head; and (vii) printing a print pattern on at least one portion of the exposed surface during the relative movement. A step of correcting data is included.