3D Printed Antenna Waveguide for PCB Impedance Stability
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Solution Overview
Problem
Integrated antenna elements in printed circuit boards for high-frequency applications often lack the required bandwidth for efficient electromagnetic wave routing, leading to impedance changes and reflection losses when connected via plug connections.
Innovation Solution
A printed circuit board design that incorporates a 3D printed antenna element with a waveguide section and a planar component carrier, where the antenna element is produced using additive manufacturing to minimize impedance changes and enable broadband antenna integration, allowing for efficient routing of high-frequency electromagnetic waves with reduced reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If integrated antenna elements are connected to printed circuit boards via plug connections, then assembly flexibility is improved, but impedance changes and reflection losses occur
Solution Approach 1:
The antenna element and printed circuit board are merged into a single integrated structure through co-manufacturing processes. The antenna element is directly formed on the PCB substrate during the same manufacturing cycle, eliminating the need for separate plug connections and ensuring continuous impedance characteristics across the transition.
Solution Approach 2:
The antenna element geometry and connection interface are pre-designed and pre-formed during PCB manufacturing. The transition region between the PCB trace and antenna element is optimized in advance to maintain impedance continuity, preventing reflection losses before the antenna operates.
2Ease of manufacture
If traditional planar antenna elements are manufactured using printed circuit board technology, then manufacturing simplicity is improved, but bandwidth is insufficient
Solution Approach 1:
The antenna element transitions from a two-dimensional planar structure to a three-dimensional structure with vertical height. This adds a new dimension to the antenna geometry, enabling broadband operation while maintaining compatibility with standard PCB manufacturing processes through additive or co-forming techniques.
Solution Approach 2:
The antenna element geometry parameters are optimized to achieve broadband performance. By adjusting the height, width, and shape parameters of the three-dimensional antenna structure, the bandwidth can be expanded while maintaining ease of manufacture through conventional PCB processes.
3Adaptability or versatility
If 3D printing processes are used to produce antenna elements, then design freedom and geometric complexity are improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is designed to perform multiple functions simultaneously. The same 3D printing or co-forming process that creates the complex three-dimensional antenna geometry also forms the PCB substrate and connection interfaces, reducing overall manufacturing complexity despite the increased design freedom.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the integration of broadband antennas with minimal impedance change, enabling efficient routing of high-frequency electromagnetic waves with reduced reflection, thus overcoming the limitations of traditional plug connections and achieving a compact, efficient design suitable for high-frequency applications.
Implementation Method 1
3D printing processes use additive processes in which the starting material is sequentially built up layer by layer in predetermined shapes
Implementation Method 2
electromagnetic waves can be routed from the printed circuit board to the antenna elements
Data Source
Figure 1~4
Figure 5~8
AI summary
A printed circuit board comprises a substantially planar substrate and a strip conductor, which is applied to a surface of the substrate. The strip conductor extends to a connection interface located on a side edge of the substrate. A waveguide section of an antenna element, manufactured using a 3D printing process, is coupled to this connection interface.