3D Printed Circuit Board Channels for Delamination-Free Wiring
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Solution Overview
Problem
Traditional circuit board manufacturing methods face issues such as metal line layer delamination, circuit board stress warping, and the need for multiple alignments to maintain tolerance, while laser holes are unsuitable for thicker materials and mechanical holes have poor shape integrity, limiting manufacturing efficiency and flexibility.
Innovation Solution
A 3D printing method is employed to create a board body with internal line channels, followed by injecting a conductive material in a liquid state, which solidifies to form a one-piece structure, reducing the need for multiple alignments and enabling complex designs, and the board body is heated to prevent deformation during injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional multi-layer metal line manufacturing methods are used with multiple exposure, development, and electroplating processes, then metal line layers can be formed, but manufacturing complexity increases and manufacturing precision deteriorates due to multiple alignments required to maintain tolerance
Solution Approach 1:
The patent merges multiple separate manufacturing processes (exposure, development, electroplating) into a single 3D printing process. The conductive structure is printed in one continuous operation, eliminating the need for multiple alignment steps and significantly improving manufacturing precision while reducing process complexity.
Solution Approach 2:
The patent replaces traditional mechanical alignment systems with a digital 3D printing system. The conductive patterns are directly deposited according to digital models, eliminating mechanical alignment requirements and the associated precision losses from multiple alignment operations.
2Length of stationary object
If laser holes are used to manufacture through-holes in thicker intermediary materials, then through-hole manufacturing is achieved, but manufacturing capability deteriorates because laser holes cannot be effectively perforated in thicker materials
Solution Approach 1:
The patent replaces laser drilling with a 3D printing approach for creating through-holes and complex conductive structures. The 3D printing method can deposit conductive material through the full thickness of intermediary materials without the limitations of laser perforation, enabling manufacturing in thicker materials.
Solution Approach 2:
The patent changes the manufacturing parameter from laser energy density to 3D printing deposition parameters. This allows controlled material placement through varying thicknesses of intermediary materials, overcoming the depth limitations of laser drilling while maintaining manufacturing ease.
3Ease of manufacture
If mechanical holes are used to manufacture through-holes, then through-hole manufacturing is achieved, but shape integrity deteriorates because mechanical holes have poor integrity of shape
Solution Approach 1:
The patent replaces mechanical drilling with 3D printing for creating through-holes and conductive structures. The 3D printing process deposits material layer by layer with precise control, producing holes and complex shapes with superior dimensional accuracy and surface integrity compared to mechanical drilling.
Solution Approach 2:
The patent applies 3D printing technology to achieve local precision in critical areas such as through-hole walls and conductive pattern edges. The layer-by-layer deposition ensures uniform wall thickness and smooth surfaces, improving shape integrity where it matters most while maintaining ease of manufacture.
4Manufacturing precision
If traditional manufacturing processes are used for circuit boards, then metal line layers can be formed, but reliability deteriorates due to metal line layer delamination and circuit board stress warping
Solution Approach 1:
The patent merges the formation of metal line layers with the board substrate manufacturing into a single integrated 3D printing process. The conductive material is deposited directly onto the board body during printing, creating strong mechanical and thermal bonds that prevent delamination and reduce stress warping.
Solution Approach 2:
The patent uses composite material deposition in the 3D printing process, where conductive material is deposited within and onto the board substrate material. This creates a composite structure with strong interfacial bonding, improving reliability by preventing delamination and reducing differential thermal expansion that causes warping.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves manufacturing efficiency by requiring only a single initial alignment, reduces delamination and warping, and allows for flexible design of metal line layers, including through-hole manufacturing and complex structures.
Implementation Method 1
injecting a conductive material in a liquid state into the line channel inside the board body through at least one opening; and the conductive material being in a solid state after cooling
Implementation Method 2
part of the heat is transferred to the board body after the conductive material in liquid state enters the line channel, which may easily lead to cooling and solidification of the conductive material
Implementation Method 3
when filling the line channel with the conductive material, the board body is preferably heated, so that the temperature of the board body is greater than or equal to the melting point of the conductive material and lower than the melting point of the board body
Data Source
AI summary
A manufacturing method for the circuit board includes the following steps: printing a board body on a carrier board using a 3D printing device, the board body having a hollow line channel in it, the line channel having openings located on an upper surface or/and a side surface of the board body; injecting a conductive material in a liquid state into the line channel inside the board body through at least one opening; the conductive material being in a solid state after cooling.