3D Printed Capacitors Embedded in Additive Manufacturing
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Solution Overview
Problem
Existing 3D printing technologies face limitations in integrating electronic components, particularly capacitors, due to additional processing operations and geometry constraints, which increase time and cost, and complicate the manufacturing process.
Innovation Solution
The development of an additive manufacturing system that uses conductive and dielectric agents to directly print capacitors within a 3D object, allowing for digital control of material deposition and voxel control to create conductive regions and dielectric layers, thereby simplifying the incorporation of electronic components and reducing design constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional component placement methods are used to integrate capacitors into 3D printed objects, then the capacitor functionality is achieved, but the manufacturing complexity and processing time increase
Solution Approach 1:
The patent merges the capacitor structure with the 3D printed object by printing conductive and dielectric materials directly within the object body. The capacitor electrodes are formed as conductive regions embedded in the 3D printed structure, eliminating the need for separate component placement operations and reducing manufacturing complexity
Solution Approach 2:
The 3D printing system is designed to print multiple material types (conductive and dielectric) using the same printing head and process, allowing the system to create both structural elements and electronic components in a single manufacturing operation, thereby reducing the number of processing steps
2Productivity
If traditional component placement methods are used, then capacitor functionality is achieved, but manufacturing time and cost increase
Solution Approach 1:
The capacitor structure is prepared and formed simultaneously with the 3D printed object during the printing process itself, rather than as a subsequent assembly step. The conductive and dielectric materials are deposited in the correct positions and configurations during the object fabrication, eliminating post-processing time
Solution Approach 2:
The patent combines multiple manufacturing operations (object fabrication and electronic component integration) into a single printing process, allowing both the structural object and the functional capacitor to be created concurrently, thereby reducing total manufacturing time and cost
3Adaptability or versatility
If traditional component placement is used, then capacitors can be integrated, but geometry constraints and design limitations are imposed
Solution Approach 1:
The patent transitions from planar component placement on the surface to three-dimensional embedding within the object volume. Conductive and dielectric regions can be positioned at any coordinates within the 3D space, enabling capacitors to be oriented in any direction and integrated throughout the object structure without geometric constraints
Solution Approach 2:
The printing system can deposit conductive and dielectric materials with precise spatial control at specific locations and orientations within the 3D printed object. This allows the capacitor geometry and orientation to be customized locally according to design requirements without being constrained by standard component placement limitations
Data Source
AI summary
In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.