3D-Printed Ceramic Feedthroughs for High-Density Implant Vias
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Solution Overview
Problem
Current ceramic manufacturing techniques are limited in producing complex geometries and high-density via structures, leading to difficulties in creating hermetic ceramic assemblies for implantable medical devices, particularly in achieving precise, reliable, and durable electrically conductive pathways with small spacings and high aspect ratios.
Innovation Solution
A 3D-printing process is used to create ceramic bodies with square-shaped vias that are transformed into rounded corners through sintering, allowing for the production of hermetic ceramic assemblies with precise positional accuracy and reduced residual stresses, enabling the creation of complex geometries and high-density feedthroughs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional drilling or machining methods are used to create vias in ceramic bodies, then electrically conductive pathways can be formed, but the via diameter is limited and small diameter vias are almost impossible to drill due to drill bit breakage
Solution Approach 1:
The patent replaces mechanical drilling and machining methods with a 3D printing process to form vias in ceramic bodies. The 3D printing process uses digital modeling and additive manufacturing to create precise via structures without the limitations of mechanical drill bits, enabling small diameter vias and complex geometries that were previously unmanufacturable.
Solution Approach 2:
The patent changes the manufacturing parameters from mechanical removal (drilling/machining) to additive construction (3D printing). This allows for precise control of via diameter, shape, and position, and enables the formation of high-density via structures with tight spacing that cannot be achieved with traditional mechanical methods.
2Productivity
If high-density closely spaced vias are drilled or machined in ceramic bodies, then electrically conductive pathways can be created, but the process becomes prohibitively difficult and time-consuming
Solution Approach 1:
The patent replaces sequential mechanical drilling operations with a parallel 3D printing process that can create multiple closely spaced vias simultaneously. The additive manufacturing process builds the ceramic body layer by layer with integrated via structures, achieving high via density and tight spacing without the time-consuming sequential drilling required by traditional methods.
Solution Approach 2:
The patent performs preliminary digital modeling and path planning before manufacturing, allowing for optimized via placement and spacing. The 3D printing process follows a pre-programmed sequence that efficiently creates high-density via structures in a single manufacturing run, rather than requiring multiple drilling operations.
3Adaptability or versatility
If complex geometries with internal features are manufactured using injection molding or die pressing, then ceramic parts can be produced, but the techniques are limited to relatively non-complex geometries
Solution Approach 1:
The patent replaces traditional mechanical forming methods (injection molding, die pressing) with 3D printing technology. The additive manufacturing process can create complex geometries, internal channels, and integrated features that are impossible to produce with conventional molding or pressing techniques, which are limited by mold complexity and part ejection requirements.
Solution Approach 2:
The patent transitions from 2D surface molding to 3D additive construction, enabling the creation of complex internal geometries and spatial features. The 3D printing process builds the ceramic body layer by layer, allowing for integrated internal channels, cavities, and via structures that cannot be achieved with traditional surface-level molding techniques.
4Manufacturing precision
If ceramic parts are machined to achieve good surface quality and dimensional precision, then accurate via holes can be created, but cutting tools are subject to severe wear and defects such as fractures and cracking can be generated
Solution Approach 1:
The patent replaces mechanical cutting and machining operations with a 3D printing process that constructs the ceramic body additively. This eliminates the generation of mechanical defects such as fractures, cracking, and chip outs that occur during machining, while maintaining precise via dimensions through digital control of the printing process.
Solution Approach 2:
The patent converts the inherent brittleness of ceramic materials from a manufacturing disadvantage into an advantage. By using 3D printing, the ceramic material can be deposited in a controlled manner that avoids mechanical stress and defect generation, while the final sintering process creates a dense, defect-free structure with high reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D-printed ceramic bodies achieve robust, reliable, and hermetic electrically conductive pathways with precise dimensions and high via densities, addressing the limitations of traditional methods and enabling the manufacture of components for miniature implantable medical devices with improved durability and functionality.
Implementation Method 1
A 3D-printing process is used to create ceramic bodies with square-shaped vias that are transformed into rounded corners through sintering
Implementation Method 2
The via is filled with an ink or paste of an electrically conductive material. This assembly is then subjected to a sintering process to complete the part
Data Source
AI summary
A method for manufacturing a ceramic substrate by a 3D-printing process is described. The method comprises operating a 3D-printer to print a green-state ceramic body having a height extending to spaced apart first and second end surfaces and at least one via extending at least part-way along the height of the green-state ceramic body from the first end surface toward the second end surface. Then, the green-state ceramic body is sintered to provide the ceramic substrate with the at least one via. In cross-section, the at least one via has a square-shaped via with rounded corners.