3D Printed Electronic Circuits Without Post-Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current 3D printing technologies for electronic devices require post-processing treatments like thermal or laser processing, which can alter the electrical and mechanical properties of materials, and lack semiconductor ink materials for direct 3D printing of semiconductor devices.
Innovation Solution
The use of Triphenylamine (TPA) as a powder binding agent in 3D printing compositions that can be melted and extruded to create functional 3D electronic circuits without the need for post-processing, combined with other materials to achieve desired electrical and mechanical properties, allowing for direct 3D printing of conductive, resistive, capacitive, and insulating materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If post-processing treatments like thermal or laser processing are used, then the electronic circuits can be formed, but the electrical and mechanical properties of materials are altered
Solution Approach 1:
The patent removes the post-processing step entirely by using a binderless approach where conductive particles are suspended in a liquid vehicle that dries to form the circuit. This extraction of the harmful thermal/laser treatment step resolves the contradiction by achieving circuit formation without altering material properties.
Solution Approach 2:
The invention changes the fundamental parameters of the printing process by using a liquid suspension that dries at ambient conditions rather than requiring high-temperature curing. This parameter change allows circuit formation while preserving the electrical and mechanical properties of the substrate and materials.
2Manufacturing precision
If aerosol jet printing is used, then fine feature electronic prints can be obtained, but post-processing oven or laser treatment is required to remove binder agents
Solution Approach 1:
The patent extracts and eliminates the binder agent used in aerosol jet printing by employing a binderless formulation. Conductive particles are suspended directly in a liquid vehicle without requiring additional binding materials, thereby removing the need for post-processing to remove binders.
Solution Approach 2:
The liquid vehicle serves as a temporary carrier that performs its function during printing and then evaporates completely, leaving no residue. This disposable approach to the liquid vehicle eliminates the need for binder removal processes.
3Strength
If conventional polymer binding agents like PLA or ABS are used, then materials can be bound, but the printed materials become brittle and unsuitable for 3D printing of electronic devices
Solution Approach 1:
The patent extracts the problematic polymer binding agents (PLA, ABS) from the formulation and replaces them with a liquid vehicle that provides binding during printing but does not create brittleness. The liquid vehicle evaporates after printing, leaving a flexible structure without rigid polymer constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the direct creation of complete functional 3D electronic circuits and devices without thermal or laser post-processing, maintaining desired electrical characteristics and mechanical flexibility, and allows for on-demand, customized production across various applications.
Implementation Method 1
The liquid vehicle can be any material that suspends the conductive particles and can be evaporated or otherwise removed to leave behind the conductive particles
Implementation Method 2
The 3D printer can include a heated stage that heats the printed material to a melting point of the printed material
Data Source
AI summary
A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.