3D-Printed Component Carrier for Precise Multilayer Integration
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Solution Overview
Problem
Conventional component carriers face challenges in manufacturing flexibility and structure arrangement due to increasing demands in miniaturization, with existing methods lacking precision and adaptability in producing multi-layer structures.
Innovation Solution
A component carrier is manufactured using a three-dimensional printing process, allowing for the formation of a stack of alternating electrically insulating and conductive layer structures, which can be designed with precision and flexibility, incorporating features like conductive connecting elements, damping elements, and thermally conductive structures, and can be formed as a rigid or flexible structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional photochemical manufacturing methods are used, then manufacturing process is well-established, but manufacturing flexibility and structure arrangement are limited
Solution Approach 1:
The patent replaces conventional photochemical manufacturing processes with three-dimensional printing technology. This substitution enables direct digital fabrication of complex multi-layer structures with precise spatial arrangement of conductive and insulating layers, achieving superior manufacturing flexibility and structural adaptability compared to traditional photochemical methods
Solution Approach 2:
The invention utilizes the ability of 3D printing to vary material properties and structural parameters during the manufacturing process. Different materials (conductive and insulating) can be deposited with precise control over layer thickness, density, and spatial distribution, enabling flexible adaptation to different design requirements without changing the fundamental manufacturing process
2Volume of moving object
If miniaturization demands increase, then component density improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs three-dimensional printing technology which offers inherent precision advantages over conventional photochemical methods. The additive manufacturing process enables precise control over material deposition at micro-scale dimensions, allowing miniaturization of component carriers while maintaining or even improving manufacturing precision through digital modeling and layer-by-layer fabrication control
3Manufacturing precision
If multi-layer structures are produced with conventional methods, then basic lamination is achieved, but precision and adaptability in structure formation are insufficient
Solution Approach 1:
The patent replaces complex photochemical lamination processes with three-dimensional printing. This substitution simplifies manufacturing by enabling direct digital fabrication of multi-layer structures in a single integrated process, eliminating the need for separate photoresist application, exposure, and development steps while achieving superior precision in layer formation and spatial arrangement
Solution Approach 2:
The invention merges the formation of multiple layers and different material types (conductive and insulating) into a single three-dimensional printing process. This consolidation of manufacturing steps into one additive process achieves both high precision in layer structure formation and simplicity in the overall manufacturing workflow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D printing process enables precise and adaptable manufacturing of component carriers with enhanced structural design, providing improved mechanical and electrical support, increased flexibility in arrangement, and better integration of components, while reducing the need for additional manufacturing steps.
Implementation Method 1
The component carrier (100) has a carrier body (101) comprising a three-dimensionally printed structure
Implementation Method 2
a treatment device (1734), in particular a laser device, which emits a laser beam for treating the printable material (1728), wherein the printable material (1728) can thereby be melted or sintered
Data Source
Figure 1~8
Figure 9~13
Figure 14~16
AI summary
A component carrier (100, 300) and a method for manufacturing a component carrier (100, 300) are described, wherein the component carrier comprises a carrier body (101, 301). The carrier body (101, 301) has a plurality of electrically conductive layer structures (104) and/or electrically insulating layer structures (103), wherein at least a part of the component carrier (100, 300) is designed as a three-dimensionally printed structure (1831, 1832, 1833).