3D Printed Electronics Without PCBs
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Solution Overview
Problem
The current process of designing and manufacturing electronics is time-consuming and costly, particularly for low-volume production, due to the separate design and fabrication of Printed Circuit Boards (PCBs) and enclosures, which involves complex PCB layout design and expensive multi-layer PCBs, and 3D printing methods that are not efficient for embedding electronic components.
Innovation Solution
A method and apparatus that integrate PCB design and mechanical enclosure design into a single process using 3D printing with a combined 3D printer and pick-and-place machine, enabling the extrusion of conductive and non-conductive materials to create electronic devices without PCBs, allowing for simultaneous manufacturing of electronic devices and their enclosures by embedding components and creating electrical connections in 3D space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional PCB and enclosure manufacturing processes are used, then manufacturing precision and reliability are maintained, but manufacturing time and cost increase significantly
Solution Approach 1:
The patent combines the PCB manufacturing process and enclosure fabrication into a single integrated 3D printing process. The multi-material 3D printer simultaneously deposits conductive material for PCB traces and non-conductive material for the enclosure, eliminating the need for separate manufacturing steps and reducing overall production time.
Solution Approach 2:
The 3D printing system performs multiple functions within a single device: it fabricates the PCB substrate, creates the enclosure, places electronic components, and forms structural supports all in one continuous process, making the manufacturing system highly versatile and efficient.
2Adaptability or versatility
If multi-layer PCBs are used to increase copper layers for routing, then trace routing capability improves, but PCB cost and complexity increase
Solution Approach 1:
The patent transitions from 2D PCB routing to 3D routing by printing conductive traces in three-dimensional space. This allows traces to route around obstacles and connect components more directly in 3D space, eliminating the need for multiple copper layers and complex via structures while maintaining or improving routing capability.
3Manufacturing precision
If separate PCB and enclosure manufacturing processes are used, then manufacturing precision is maintained, but setup cost and production time increase
Solution Approach 1:
The patent merges PCB fabrication and enclosure manufacturing into a single 3D printing process, where both structures are created simultaneously in their final positions. This integration maintains precision through the 3D printer's accurate material deposition while dramatically simplifying the manufacturing process by eliminating separate fabrication steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and costs while maintaining design efficiency, making it suitable for both low-volume and high-volume production, and allows for quick-turn prototyping and flexible design without the limitations of traditional PCBs.
Implementation Method 1
3D printers and 3D printing process with extrusion of melted thermoplastic or metals are well known
Implementation Method 2
3D printers and 3D printing process with extrusion of melted thermoplastic or metals are well known
Data Source
AI summary
The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.