3D Printed Electronics via Voxel-Level Agent Deposition
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Solution Overview
Problem
Current 3D printing techniques require multiple steps and specialized equipment to build and embed electronics within dense parts, making the process complex and costly due to the need for electroplating and proprietary activation procedures.
Innovation Solution
The method employs multi jet fusion (MJF) to impart electronic properties at a voxel level by using a fusing agent and electronic agents, which are jettable via thermal and piezoelectric inkjet printheads, eliminating the need for specialized equipment and allowing control over the introduction of electronic properties at the voxel surface or volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional 3D printing techniques are used to build and embed electronics, then electronics can be integrated into 3D printed parts, but the process becomes complex and costly requiring multiple steps and specialized equipment
Solution Approach 1:
The patent combines the electronics integration process with the existing 3D printing workflow by incorporating electronic agents into the inkjet printing system. This merging eliminates the need for separate electroplating and activation equipment, reducing overall process complexity while maintaining electronic integration capability.
Solution Approach 2:
The inkjet printing system is designed to perform multiple functions: depositing both traditional printing materials and electronic agents containing conductive materials. This multi-functionality allows the same equipment to handle both structural printing and electronics integration, reducing the need for specialized equipment.
2Adaptability or versatility
If traditional 3D printing techniques are used to build and embed electronics, then electronics can be integrated into 3D printed parts, but specialized equipment such as electroplating and annealing equipment is required
Solution Approach 1:
The patent extracts the electronic integration function from traditional manufacturing processes and incorporates it directly into the inkjet printing system. By removing the need for separate electroplating and annealing equipment, the process becomes simpler and more accessible.
Solution Approach 2:
The electronic agents contain conductive materials that self-assemble or self-activate within the printed structure, eliminating the need for external activation procedures. The printing process itself deposits the functional materials in the correct locations without requiring additional specialized processing steps.
3Reliability
If multiple processing steps are used to integrate electronics, then electronic properties can be imparted to 3D printed parts, but the process becomes costly and complex
Solution Approach 1:
The conductive materials are pre-loaded into the electronic agents that are deposited during the inkjet printing process. This preliminary incorporation of functional materials eliminates the need for subsequent activation or treatment steps, reducing both process complexity and cost while maintaining reliable electronic property impartment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the integration of electronics into 3D printed parts by enabling the creation of various devices with different electronic properties without the need for additional processing steps or equipment, such as annealing, thereby reducing complexity and cost.
Implementation Method 1
The fusing agent is capable of absorbing electromagnetic radiation and converting the absorbed radiation to thermal energy, which in turn melts or sinters the build material that is in contact with the fusing agent
Implementation Method 2
The thermal inkjet printhead heats liquid electronic agent to form a droplet
Implementation Method 3
The piezoelectric inkjet printhead ejects liquid electronic agent in response to an applied voltage
Data Source
AI summary
In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.