3D Printed Encapsulant for Electronic Interconnect Protection
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Solution Overview
Problem
Existing methods for protecting electronic interconnect devices from environmental effects, such as moisture and mechanical stress, using molding compounds are costly and require significant processing effort, limiting their practicality and adaptability.
Innovation Solution
A method involving 3D printing of an encapsulating material, like epoxy resin, to cover electronic components on a printed circuit board, ensuring a precise and cost-effective protection by applying the material in drops or layers after heating the device to its cross-linking temperature, allowing for flexible adaptation to different component arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding compound is used as the housing to protect electronic interconnect devices, then protection against environmental effects is improved, but processing effort and material costs increase
Solution Approach 1:
The patent changes the physical state of the encapsulating material from solid to liquid during application, then utilizes cross-linking to transform it into a protective housing structure. This parameter change allows the material to flow into complex geometries and conform to component arrangements, eliminating the need for complex injection molding tools while achieving effective environmental protection.
Solution Approach 2:
The patent replaces the mechanical injection molding process with a chemical cross-linking process. Instead of using high-pressure injection tools to force molding compound into cavities, the method applies a cross-linkable material that chemically bonds to form the housing structure, significantly simplifying the manufacturing system.
2Reliability
If a molding compound is used as the housing to protect electronic interconnect devices, then protection against environmental effects is improved, but material costs increase
Solution Approach 1:
The patent employs a cross-linkable material that can be applied in liquid form and then cured in place, eliminating the need for expensive reusable injection molding tools and molds. The material itself becomes the housing structure, removing the need for separate tooling investments and reducing overall manufacturing costs.
3Reliability
If a molding compound is used as the housing, then protection against environmental effects is improved, but adaptability to different component arrangements decreases
Solution Approach 1:
The patent introduces dynamic adaptability by using a liquid cross-linkable material that can be applied to accommodate varying component arrangements. The material flows to conform to any configuration of electronic components on the circuit board, then cross-links to form a rigid protective housing. This allows the same manufacturing process to adapt to different product designs without requiring new molds or tooling.
Solution Approach 2:
By changing the material from solid (molding compound) to liquid (cross-linkable material during application), the system gains flexibility to adapt to different component layouts. The liquid state allows the material to flow around and conform to any arrangement of components, then the cross-linking process transforms it into a solid protective structure tailored to that specific arrangement.
4Reliability
If encapsulating material is applied by conventional methods, then protection is achieved, but manufacturing precision and material conservation decrease
Solution Approach 1:
The patent utilizes the viscosity and flow characteristics of liquid cross-linkable materials to achieve precise encapsulation. The material can be applied in controlled amounts and conform exactly to the contours of electronic components and circuit board features, eliminating the need for extensive post-processing or trimming that would be required with conventional molding methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides an inexpensive and efficient protection of electronic interconnect devices from environmental effects, ensuring moisture exclusion and precise encapsulation, suitable for applications in motor vehicle sensors and control devices.
Implementation Method 1
the encapsulating material is melted in the 3D printing process, and applied to the electronic interconnect device in drops or layers
Implementation Method 2
the electronic interconnect device is heated to the cross-linking temperature of the encapsulating material
Implementation Method 3
The cross-linking temperature is the temperature thereby, at which the 3D printing material, thus the encapsulating material, bonds in an optimal manner to the substance, thus the electronic interconnect device
Implementation Method 4
the encapsulating material is applied to the electronic interconnect device by means of a 3D printing process
Data Source
AI summary
The present disclosure provides a method for protecting an electronic interconnect device from environmental effects. The electronic interconnect device may be connected to at least one electronic component, wherein the electronic interconnect device and the at least one electronic component are at least partially covered with an encapsulating material in a material-bonded manner. The method may include applying the encapsulating material to the electronic interconnect device with a 3D printer during a 3D printing process.