3D Printed Hermetic Package Assembly for Extended Temperature Reliability
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Solution Overview
Problem
Conventional integrated circuits packaged in commercial-grade plastic packages are not suitable for demanding environments requiring extended temperature ranges, leading to reliability issues and obsolescence challenges, especially in military and high-temperature applications.
Innovation Solution
A method involving the removal of existing ball bonds from a semiconductor die, reconditioning, and 3D printing of bond connections and encapsulation to create a hermetic assembly within a hermetic substrate, utilizing 3D printing to form reliable connections and encapsulants for enhanced reliability and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If commercial-grade plastic packages are used for integrated circuits, then cost is reduced and ease of manufacture is improved, but reliability at extended temperatures deteriorates
Solution Approach 1:
The patent changes the material parameters of the package from commercial-grade plastic to hermetic materials (metal or ceramic) that can withstand extended temperature ranges. This parameter change enables the integrated circuit to operate reliably in demanding environments while maintaining manufacturing feasibility through established hermetic packaging processes.
2Reliability
If hermetic packages are used for integrated circuits, then reliability at extended temperatures is improved, but cost increases and ease of manufacture deteriorates
Solution Approach 1:
The patent segments the packaging process into distinct stages: hermetic package creation, die attachment, wire bonding, and sealing. This segmentation allows each stage to be optimized independently, making the complex hermetic packaging process more manageable and easier to manufacture while maintaining high reliability standards.
Solution Approach 2:
The patent performs preliminary actions by pre-attaching the semiconductor die to the hermetic package substrate and pre-wire bonding connections before final sealing. This preliminary preparation simplifies the overall manufacturing process and improves ease of manufacture while ensuring reliability through proper hermetic encapsulation.
3Reliability
If hermetic packages are used for integrated circuits, then reliability at extended temperatures is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the hermetic package structure: the package substrate serves as both the mechanical support and the electrical interconnection carrier, while the encapsulant provides both structural sealing and environmental protection. This merging reduces device complexity by eliminating separate components and simplifying the overall architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides integrated circuits that operate reliably at extended temperatures, are more compact, and offer improved reliability compared to conventional methods, addressing the limitations of commercial-grade packaging and obsolescence issues.
Implementation Method 1
3D printing, by a 3D printer, a plurality of bond connections between die pads of the extracted die and first bond pads of the hermetic substrate
Data Source
AI summary
A method is provided. The method includes one or more of removing existing ball bonds from an extracted die, placing the extracted die into a recess of a hermetic substrate, the extracted die having a centered orientation in the recess, and applying a side fill compound into the recess between the extracted die and the hermetic substrate. The method also includes 3D printing, by a 3D printer, a plurality of bond connections between die pads of the extracted die and first bond pads of the hermetic substrate in order to create a 3D printed die substrate, and 3D printing a hermetic encapsulation over the die, the side fill compound, and the 3D printed bond connections in order to create a hermetic assembly. The extracted die includes a fully functional semiconductor die removed from a previous package. The hermetic substrate includes the first bond pads coupled to second bond pads.