3D-Printed Housing With Embedded Electronics and Environmental Sealing
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Solution Overview
Problem
Existing electronic systems face challenges in minimizing the size and weight of housings while ensuring environmental sealing and secure mounting of electronic assemblies, particularly in applications with size and weight limitations such as aerospace, wearable devices, and mobile devices.
Innovation Solution
The use of additive manufacturing processes to fabricate a housing as a single component around an embedded electronic assembly, eliminating the need for additional fastening devices and materials, and incorporating environmental sealing through connectors and sealants to protect the assembly from external environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional multi-component housing assembly methods are used to secure electronic assemblies, then the electronic assembly can be mounted within the housing, but the size and weight of the housing increase due to additional fastening devices and materials
Solution Approach 1:
The housing and electronic assembly are merged into a single integrated structure fabricated using additive manufacturing. The electronic assembly is embedded directly within the housing material during the 3D printing process, eliminating the need for separate fastening devices, adhesives, and multiple housing components. This integration reduces the overall weight while maintaining secure mounting of the electronic assembly.
2Reliability
If traditional multi-component housing assembly methods are used to secure electronic assemblies, then the electronic assembly can be mounted within the housing, but the size of the housing increases due to additional fastening devices and materials
Solution Approach 1:
The housing and electronic assembly are merged into a single integrated structure fabricated using additive manufacturing. The electronic assembly is embedded directly within the housing material during the 3D printing process, eliminating the need for separate fastening devices, adhesives, and multiple housing components. This integration reduces the overall volume while maintaining secure mounting of the electronic assembly.
3Ease of manufacture
If housing components are separated to allow assembly, then the electronic assembly can be installed, but environmental sealing becomes more difficult to achieve
Solution Approach 1:
The housing and electronic assembly are merged into a single integrated structure fabricated using additive manufacturing. The electronic assembly is embedded directly within the housing material during the 3D printing process, creating a seamless structure with no gaps or joints. This integration maintains excellent environmental sealing while allowing for easy installation through the additive manufacturing process itself.
4Reliability
If multiple housing components and fastening devices are used, then the electronic assembly can be securely mounted, but the device complexity increases
Solution Approach 1:
The housing and electronic assembly are merged into a single integrated structure fabricated using additive manufacturing. The electronic assembly is embedded directly within the housing material during the 3D printing process, eliminating the need for separate fastening devices, adhesives, and multiple housing components. This integration significantly reduces the device complexity while maintaining secure mounting of the electronic assembly.
5Weight of stationary object
If additive manufacturing is used to fabricate housing as a single component, then the size and weight of the housing are reduced, but the manufacturing process complexity increases
Solution Approach 1:
The patent utilizes additive manufacturing technology to fabricate the housing as a single integrated component with embedded electronic assemblies. This manufacturing approach enables complex geometries and internal structures that would be difficult or impossible to achieve with traditional manufacturing methods. The layer-by-layer deposition process allows for precise control of material placement, enabling the housing to be formed with integrated mounting features and environmental sealing characteristics.
Data Source
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AI summary
Systems and methods for embedding electronics in a housing using additive manufacturing are provided. In certain embodiments, a system includes a housing made using an additive manufacturing process. The system also includes at least one electronics assembly that is embedded into the housing during the additive manufacturing process, wherein one or more electronic components on the at least one electronic assembly are isolated from the material used to form the housing. Further, the system includes an electrical connector coupled to at least one electronic component in the one or more electronic components, wherein the electrical connector provides an electrical connection between the at least one electronic assembly and system electronics that are outside the housing, wherein the electronic assembly is environmentally sealed within the housing from the environment outside the housing.