3D Printed Mecatronic System Integrating Conductive and Insulating Materials
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Solution Overview
Problem
Current 3D printing techniques cannot manufacture complete mechatronic systems in one piece, as they require separate assembly of mechanical and electrical components, leading to increased costs, mechanical fragility, and bulkiness due to the use of hybrid techniques.
Innovation Solution
The method involves using three-dimensional printing by deposition of molten wire to integrate both mechanical structures and electrical components, such as conductive tracks or sensors, directly into the mechanical structure using distinct materials, an electrically insulating material for the structure and a conductive material for the electrical components, eliminating the need for additional assembly steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate assembly of mechanical and electrical components is used, then manufacturing flexibility is maintained, but device complexity and assembly requirements increase
Solution Approach 1:
The patent merges mechanical structures and electrical components into a single integrated mechatronic system manufactured by 3D printing. The mechanical support structure and electrical components (conductive tracks, sensors, actuators) are printed together as one unified object, eliminating separate assembly operations and reducing device complexity while maintaining manufacturing flexibility through additive processes.
2Productivity
If hybrid manufacturing techniques are used, then complete mechatronic systems can be produced, but mechanical fragility and bulkiness increase
Solution Approach 1:
The patent employs composite materials in the 3D printing process, combining conductive and insulating materials within a single mechanical structure. The insulating material forms the structural framework providing mechanical strength, while conductive material is embedded within to create electrical pathways and components. This composite approach enables complete mechatronic system production without compromising mechanical integrity or creating bulkiness.
3Reliability
If separate manufacturing of electrical components is used, then material properties are optimized, but manufacturing time and cost increase
Solution Approach 1:
The patent applies preliminary action by embedding conductive and insulating materials during the 3D printing process itself, rather than manufacturing electrical components separately and assembling them later. The conductive material is deposited in predetermined locations within the mechanical structure during the printing process, pre-forming electrical pathways and components. This eliminates subsequent assembly time while maintaining optimized material properties through selective material placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the cost-effective, flexible, and efficient production of complex 3D mechatronic objects with reduced assembly requirements, enhancing mechanical properties and environmental interaction capabilities while minimizing mechanical fragility and bulkiness.
Implementation Method 1
three-dimensional printing by deposition of molten wire
Implementation Method 2
at least a second material, conductive or resistive, used to print the electrical component(s)
Data Source
Figure 1~2C
Figure 3~4E
Figure 5A~5C
AI summary
Process and apparatus for manufacturing a mecatronic system, the process comprising: • - a step of manufacturing a mechanical structure (SM) by three-dimensional printing by depositing molten wire of at least one electrically insulating first material (MI); and • - a step of manufacturing at least one electrical component (CE) in contact with at least one element of said mechanical structure and securely fasten therewith; said step of manufacturing at least one electrical component being implemented by 3-D printing by depositing molten wire of at least one conductive or resistive second material (M2) directly in contact with said element of the mechanical structure. A mecatronic system capable of being manufactured by such a process is also presented.