3D Printed Protective Shell for Stress-Sensitive MEMS Packaging
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Solution Overview
Problem
Current semiconductor packaging methods fail to adequately protect stress-sensitive micro-electro-mechanical systems (MEMS) devices from external stresses while allowing for necessary flexibility and performance, as conventional methods like glop-tops do not provide optimal mechanical support and protection against contamination and moisture.
Innovation Solution
A semiconductor package is developed using a protective shell formed by 3D printing technology, which creates a cavity space above the semiconductor die and can be filled with thermally conductive, electrically insulating materials, providing mechanical support and protection while allowing for free vibration and motion, and is formed using ink residue that is strong enough to withstand packaging stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods like glop-tops are used, then the die is covered and protected, but the mechanical support and protection against external stresses is insufficient for stress-sensitive MEMS devices
Solution Approach 1:
The protective shell is segmented into multiple functional zones: a first portion covering stress-sensitive regions of the die, and a second portion providing structural support. This segmentation allows each portion to be optimized for its specific function - the first portion provides stress protection while the second provides mechanical strength, resolving the contradiction between protection and structural complexity.
Solution Approach 2:
The protective shell utilizes composite material construction with a hermetic seal portion providing environmental protection and a structural support portion providing mechanical strength. This composite approach enables the packaging to simultaneously achieve superior stress protection and mechanical support without excessive complexity.
2Reliability
If low modulus materials like silicone glop top are used to protect the die, then mechanical isolation is provided, but flexibility for vibration and motion is compromised
Solution Approach 1:
The protective shell implements local quality by providing different mechanical properties in different regions: the first portion directly covering the die offers mechanical isolation with controlled modulus, while the second portion provides structural support. This localized differentiation maintains mechanical isolation where needed while preserving flexibility for vibration and motion in other areas.
Solution Approach 2:
The protective shell employs flexible shell design with controlled thickness and material properties that allow the structure to flex and accommodate vibration and motion of the MEMS device while maintaining hermetic seal and mechanical isolation. The shell is not rigid but has appropriate flexibility to allow device operation.
3Reliability
If the protective shell is made hermetic to prevent contamination and moisture, then protection is enhanced, but thermal dissipation may be affected
Solution Approach 1:
The protective shell acts as an intermediary structure that provides hermetic sealing to prevent contamination and moisture ingress while incorporating thermal management features. The shell material and design serve as a mediator between the need for environmental protection and thermal dissipation requirements, allowing heat to be managed while maintaining the hermetic barrier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D printed protective shell effectively supports and protects the semiconductor die from external stresses, enhances thermal dissipation, and maintains the device's performance by providing a hermetic seal and mechanical isolation, outperforming traditional packaging methods in terms of flexibility and reliability.
Implementation Method 1
A protective shell formed by 3D printing technology, which creates a cavity space above the semiconductor die
Implementation Method 2
can be filled with thermally conductive, electrically insulating materials, providing mechanical support and protection
Implementation Method 3
The protective shell creates a hermetic seal with the first surface of the semiconductor die
Data Source
AI summary
In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.