3D Printed Microphone Package Monolithic Integration
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Solution Overview
Problem
Advanced packaging of integrated devices, such as microphones and processors, faces challenges in forming conductors and cavities at desired locations within packages, and in accommodating various mounting configurations without significant redesign costs.
Innovation Solution
The use of three-dimensional (3D) printing techniques to monolithically integrate conductors and non-conductive materials into a unified structure, allowing for the formation of complex geometries and arbitrary shapes, including reversible top and bottom port packages that can be oriented as either top or bottom port configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging methods are used with multiple conductors and separate components, then electrical connection and shielding are achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple separate components (conductors, housing, mounting structures) into a single monolithic package structure formed by one or more integrated dies. This merging reduces the number of discrete parts and assembly steps while maintaining electrical connection and shielding functions through integrated conductor patterns and structural design.
Solution Approach 2:
The package structure is designed to perform multiple functions simultaneously: the housing provides mechanical protection and mounting, conductors provide electrical connection and RF shielding, and the integrated design enables both top and bottom mounting orientations. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process.
2Adaptability or versatility
If packages are redesigned for various mounting configurations, then adaptability to different systems is improved, but manufacturing cost increases
Solution Approach 1:
The package is designed with symmetric mounting features and conductor arrangements that allow it to be mounted in multiple orientations (top or bottom mounting) without requiring different package designs. This universal mounting capability enables the same package structure to adapt to various system configurations while maintaining cost-effective manufacturing through standardized production processes.
Solution Approach 2:
The package incorporates asymmetric conductor patterns and mounting feature placements that enable flexible orientation options. By strategically positioning conductors and mounting structures, the package can be adapted to different mounting configurations without requiring complete redesign, achieving versatility through controlled asymmetric design rather than multiple symmetric variants.
3Adaptability or versatility
If conductors and cavities are formed at arbitrary locations in advanced packaging, then design flexibility is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent integrates conductor formation, cavity creation, and housing structure into a single monolithic die fabrication process. Conductors are formed as integrated patterns within the die structure, and cavities are created through the same manufacturing process, eliminating the need for separate post-processing steps and reducing manufacturing difficulty despite arbitrary location requirements.
Solution Approach 2:
The manufacturing approach utilizes changes in material properties and processing parameters during die formation to achieve arbitrary conductor locations and cavity positions. By controlling conductor material deposition, removal, and integration parameters, the process can place conductors and cavities at any required location within the package structure without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of flexible packaging solutions that can be used in various applications, reducing redesign costs and enhancing the integration of integrated devices by allowing for complex geometries and improved electromagnetic interference shielding.
Implementation Method 1
forming a housing by employing a three-dimensional (3D) printing technique to form a non-conductive base having a plurality of integrated horizontal conductors and a non-conductive wall having a plurality of integrated vertical conductors
Data Source
AI summary
A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.