3D-Printed Package Heat Dissipation With Non-Parallel Thermal Paths
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Solution Overview
Problem
The design of heat dissipating structures in semiconductor packages affects the heat dissipation efficiency, reliability, and yield of semiconductor electronic structures, with existing methods not adequately addressing the varying heat generation of different electronic devices within the package.
Innovation Solution
A package structure with a first and second heat dissipating structure formed through 3D printing, where the first heat dissipating structure has a greater thickness than the second, and both structures have non-parallel thermal paths to a heat sink, enhancing heat dissipation efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a uniform thickness heat dissipating structure is used for all electronic devices, then the manufacturing process is simplified, but the heat dissipation efficiency is reduced for devices with different heat generation characteristics
Solution Approach 1:
The heat dissipating structure is designed with spatially varying thickness: a first thickness for regions above first electronic devices and a second thickness for regions above second electronic devices. This local differentiation allows optimization of heat dissipation for each device type while maintaining a single integrated structure that can be manufactured in one process.
2Reliability
If multiple separate heat dissipating structures are manufactured individually, then each structure can be optimized for its specific device, but the manufacturing complexity and cost increase
Solution Approach 1:
Multiple heat dissipating structures for different electronic devices are merged into a single integrated structure. This unified structure incorporates different thickness regions to serve multiple devices simultaneously, reducing manufacturing steps while maintaining device-specific heat dissipation optimization.
3Device complexity
If parallel thermal paths are used for heat dissipation, then the structure is simpler, but thermal interference between adjacent devices occurs
Solution Approach 1:
The thermal paths are segmented into non-parallel trajectories that diverge as they extend upward from the electronic devices. This segmentation prevents thermal interference between adjacent devices while maintaining structural simplicity and avoiding the need for complex thermal barriers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation efficiency, reliability, and yield by optimizing thermal paths and reducing manufacturing costs, while allowing for flexible design flexibility through 3D printing.
Implementation Method 1
The first portion of the first heat dissipating structure and the first portion of the second heat dissipating structure are concurrently formed through a 3D printing technique
Implementation Method 2
a heat dissipating structure is formed or disposed on a top surface of the semiconductor package structure so as to dissipate the heat generated from the semiconductor device(s) in the semiconductor package structure during operation to a heat sink disposed over the heat dissipating structure
Implementation Method 3
The first thermal path is thermally insulated from the second thermal path
Data Source
AI summary
An electronic structure includes a package structure, a first heat dissipating structure and a second heat dissipating structure. The package structure has a top surface including a first region and a second region. A first predetermined temperature at the first region is higher than a second predetermined temperature at the second region. The first heat dissipating structure includes a first portion disposed on the first region. The second heat dissipating structure includes a first portion disposed on the second region. The first portion of the first heat dissipating structure and the first portion of the second heat dissipating structure are concurrently formed through a 3D printing technique. A thickness of the first portion of the first heat dissipating structure is greater than a thickness of the first portion of the second heat dissipating structure.