3D Printed Semiconductor Package With VP Encapsulation Precision
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Solution Overview
Problem
Existing semiconductor device packaging technologies face challenges in efficiently encapsulating integrated circuits and creating three-dimensional structures with high precision and functionality, while mitigating physical and thermal stress.
Innovation Solution
Utilizing vat photopolymerization (VP) to selectively cure liquid encapsulation material around semiconductor devices, allowing for the formation of customized three-dimensional structures and functional features, such as microfluidic channels and inductors, by controlling light exposure and using multiple resin baths with different properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional encapsulation methods are used, then the packaging process is simple and fast, but the manufacturing precision and functional integration are limited
Solution Approach 1:
The patent replaces traditional mechanical encapsulation methods with vat photopolymerization (VP), a light-based additive manufacturing process. This substitution enables precise control of encapsulation material deposition through selective light curing, achieving high manufacturing precision while integrating complex functional features like microfluidic channels and inductors directly into the packaging structure
Solution Approach 2:
The patent utilizes changes in the physical and chemical parameters of photopolymer resin materials to achieve different functional properties in the encapsulation structure. By selecting resins with specific properties (conductivity, flexibility, optical properties) and controlling curing parameters (light intensity, exposure time), the process achieves both high precision and functional integration
2Adaptability or versatility
If complex three-dimensional structures are created, then functional integration is enhanced, but the manufacturing time increases
Solution Approach 1:
The patent performs preliminary actions by designing and preparing digital 3D models of the encapsulation structure with all functional features (microfluidic channels, inductors, thermal management paths) integrated before manufacturing. This allows the VP process to directly fabricate the complete functional structure in one continuous build process, enhancing functional integration while maintaining efficient throughput
Solution Approach 2:
The patent maintains continuity of useful action through the layer-by-layer additive manufacturing process of VP, where each layer is continuously deposited and cured without removal or repositioning of the semiconductor device. This continuous process integrates multiple functional features simultaneously, achieving both high functional integration and manufacturing efficiency
3Reliability
If selective material properties are implemented, then stress mitigation is improved, but the material selection and process complexity increase
Solution Approach 1:
The patent applies local quality by using vat photopolymerization to create encapsulation structures with spatially varying material properties. Different regions of the encapsulation can have different resin compositions, fillers, or cross-linking densities tailored to local requirements - such as flexible regions for stress relief, conductive regions for electrical shielding, or thermally conductive regions for heat management - thereby improving stress mitigation through localized material optimization
Solution Approach 2:
The patent utilizes composite materials by incorporating various fillers, particles, or reinforcement elements into the photopolymer resin formulation. These composites provide tailored mechanical, thermal, electrical, or optical properties in specific regions of the encapsulation structure, enabling stress mitigation and functional integration while managing material selection complexity through systematic composite design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-resolution, high-throughput encapsulation of semiconductor devices with integrated functional structures, reducing stress and enhancing performance through tailored material properties and precise feature formation.
Implementation Method 1
illuminating the liquid encapsulation material to polymerize the liquid encapsulation material
Data Source
AI summary
In described examples, an integrated circuit comprises: a substrate; a semiconductor die on the substrate; and a device on the substrate and electrically coupled to the semiconductor die, the device including a polymer structure coated with a metal.