3D Printed Polishing Pad Formulation for Uniform CMP
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Solution Overview
Problem
Chemical mechanical polishing (CMP) pads face challenges in achieving uniform polishing due to variations in material removal rates across different areas of a substrate, leading to over- or under-polishing, and existing manufacturing methods are costly and time-consuming, requiring molds and multiple processing steps.
Innovation Solution
A formulation for 3D printing of polishing pads using a urethane acrylate oligomer synthesized with difunctional polyols or polythiols, which is UV curable and has a low viscosity for layer-by-layer deposition, allowing for the creation of pads with specific properties such as high modulus and elasticity, and the ability to incorporate abrasive particles and grooves for improved polishing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional molding or casting methods are used to manufacture polishing pads, then the pads can be produced with consistent material properties, but the manufacturing process is costly and time-consuming requiring molds and multiple processing steps
Solution Approach 1:
The invention changes the manufacturing approach from subtractive (molding, casting, slicing, machining) to additive (3D printing), fundamentally altering the process parameters and eliminating multiple sequential steps into a single integrated manufacturing operation
Solution Approach 2:
The polishing pad is manufactured layer-by-layer through 3D printing, where each layer is deposited and cured sequentially, allowing for precise control of thickness and properties while eliminating the need for post-manufacturing slicing and machining operations
2Manufacturing precision
If traditional molding methods are used to manufacture polishing pads, then pads can be produced with uniform thickness, but the process requires molds and multiple processing steps increasing complexity
Solution Approach 1:
The desired thickness and geometric features are programmed into the 3D printing process before manufacturing begins, allowing precise thickness control (e.g., 0.05mm to 5mm) to be achieved directly during deposition without requiring subsequent machining or slicing operations
Solution Approach 2:
The invention transitions from mold-based manufacturing where thickness is determined by physical tooling to digital manufacturing where thickness is controlled by software parameters, enabling easier adjustment and optimization of pad dimensions
3Strength
If standard polyurethane materials are used for polishing pads, then the pads provide durable roughened surface, but achieving specific mechanical properties requires additional processing
Solution Approach 1:
The invention uses photopolymerizable compositions containing silane-modified polyurethane resins that can be infused with abrasive particles during the 3D printing process, creating composite structures where the matrix material and abrasive particles work together to provide both structural integrity and polishing function
Solution Approach 2:
The 3D printing process allows different regions of the polishing pad to have different material compositions and properties, enabling optimization of specific areas for different functions (e.g., varying abrasive concentration, particle size, or resin composition in different zones of the pad)
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D printing method enables the fabrication of CMP pads with uniform thickness and surface roughness, achieving consistent polishing performance and reducing manufacturing costs by eliminating the need for molds and multiple processing steps, while allowing for customization of properties like elongation and tensile strength.
Implementation Method 1
The formulation includes a photoinitiator... applying light to the formulation to cure the urethane acrylate oligomer as injected
Data Source
AI summary
A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.