3D-Printed Flexible Structures for Scalable Power Modules
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Solution Overview
Problem
Existing power module manufacturing methods face challenges in scaling down springs to fit smaller power semiconductor bodies, limiting their applicability and increasing costs due to complex assembly processes and high part counts.
Innovation Solution
The method involves additive manufacturing, specifically 3D printing, to produce flexible structures that can compensate for height differences between power semiconductor bodies, allowing for efficient pressure application and reduced part counts, enabling the production of scalable, cost-effective power modules with enhanced flexibility and robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional springs are used to apply pressure to power semiconductor bodies, then good electrical contact is achieved, but the springs cannot be easily downscaled to fit smaller power semiconductor bodies
Solution Approach 1:
The patent changes the fundamental parameters of the pressure application mechanism by transitioning from traditional metal springs to additive manufactured flexible structures. These flexible structures can be designed with varying geometries, materials, and mechanical properties to accommodate different power semiconductor body sizes, thereby maintaining adaptability while achieving reliable electrical contact through controlled pressure application.
Solution Approach 2:
The patent replaces the conventional mechanical spring system with additive manufactured flexible structures that combine mechanical pressure application with electrical conductivity. This substitution allows for integrated design where the same component performs both pressure application and electrical contact functions, enabling scalability across different device sizes without requiring separate spring components.
2Ease of manufacture
If multiple separate components are used in the power module assembly, then each component can be optimized for its specific function, but the assembly process becomes complex and part count increases
Solution Approach 1:
The patent merges multiple separate components into integrated additive manufactured flexible structures. These structures combine pressure application, electrical conductivity, and mechanical support functions into single components, reducing part count and simplifying assembly processes while maintaining the ability to optimize each functional aspect through design parameters and material selection.
Solution Approach 2:
The additive manufactured flexible structures serve multiple functions simultaneously: they apply pressure to ensure good electrical contact, provide electrical conductivity for current flow, and offer mechanical support for the power semiconductor bodies. This multi-functionality reduces the need for separate specialized components, thereby simplifying the overall assembly process.
3Productivity
If conventional manufacturing methods are used for pressure application components, then production is established, but costs increase due to high part counts and complex assembly
Solution Approach 1:
The patent segments the manufacturing process by using additive manufacturing to create complex flexible structures in single pieces rather than assembling multiple components. This segmentation of the manufacturing approach (additive manufacturing vs. traditional assembly) reduces part count and simplifies production while maintaining the stability and reliability needed for power module manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of power modules with homogenous pressure distribution, increased power cycling capability, and reduced costs by utilizing 3D printed flexible structures that can fit both small and large semiconductor bodies, improving the scalability and reliability of power modules for high-current applications.
Implementation Method 1
the first number N of flexible structures are configured to compensate height differences of the first number N of the power semiconductor bodies
Implementation Method 2
the first number N of flexible structures is additive manufactured on the first number N of preforms
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5B
AI summary
A method for producing a power module (10) comprises providing a first plate (11), providing a second plate (12), arranging a first number N of power semiconductor bodies (13 to 18) on the first plate (11), additive manufacturing of a first number N of flexible structures (23 to 28) or providing a first number N of additive manufactured flexible structures (23 to 28) and forming a stack comprising the first plate (11), the first number N of power semiconductor bodies (13 to 18), the first number N of flexible structures (23 to 28) and the second plate (12).