3D-Printed Probe Card Assembly for Precise Semiconductor Testing
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Solution Overview
Problem
Conventional probe cards face issues such as dimensional errors, assembly challenges, poor contact, and increased production costs due to labor-intensive assembly processes, especially with the miniaturization of semiconductor components, which affect accuracy and impedance matching.
Innovation Solution
The method involves direct additive manufacturing of probes on a carrier board using conductive materials, eliminating the need for conventional guide plates and allowing for precise, stable electrical connections through 3D printing, enabling probes with varying dimensions and materials to accommodate height differences and improve impedance matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional probes are manufactured by traditional machining methods and assembled through guide plates, then the probe card can be produced with basic functionality, but dimensional errors occur and assembly is labor-intensive and time-consuming
Solution Approach 1:
The patent merges the probe and probe guiding portion into a single integrated structure manufactured via additive manufacturing. The probe is directly formed on the probe guiding portion in one manufacturing process, eliminating the separate assembly steps of inserting probes through guide plates. This integration resolves the contradiction by simultaneously improving assembly efficiency (no manual assembly needed) and dimensional accuracy (single-process manufacturing without assembly deviations).
Solution Approach 2:
The patent replaces the mechanical assembly system (manual insertion of probes through guide plates) with an additive manufacturing system that directly fabricates the probe-integrated-structure. This substitution eliminates the labor-intensive and error-prone mechanical assembly process while achieving high dimensional precision through controlled material deposition, thereby resolving both the productivity and manufacturing precision issues.
2Manufacturing precision
If probes are assembled through guide plates to maintain positioning accuracy, then probe arrangement can be maintained, but assembly problems occur and deviations frequently occur
Solution Approach 1:
The patent combines the probe and probe guiding portion into one monolithic structure manufactured through additive manufacturing. This integration eliminates the interface between separate components that causes assembly deviations and positioning errors. The single-process manufacturing ensures consistent probe positioning without the reliability issues of manual assembly, resolving both precision and reliability concerns simultaneously.
3Reliability
If conventional guide plates are used to position multiple probes, then probe arrangement is maintained, but poor contact between probe and probe guiding portion occurs due to floating
Solution Approach 1:
The patent integrates the probe and probe guiding portion into a single continuous structure manufactured by additive manufacturing. This eliminates the floating connection and poor electrical contact inherent in conventional assemblies where probes are inserted through guide plates. The merged structure ensures reliable electrical contact while simplifying the overall device complexity by removing the separate guide plate component.
4Ease of manufacture
If traditional machining methods are used for probe manufacturing, then basic probe structure can be achieved, but labor-intensive assembly increases production cost
Solution Approach 1:
The patent replaces the traditional mechanical machining and manual assembly system with an additive manufacturing system. The additive process directly fabricates the integrated probe-probe guiding structure in one operation, eliminating labor-intensive assembly steps. This substitution reduces production costs by automating the manufacturing process and improving productivity through single-step fabrication, resolving both ease of manufacture and productivity concerns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances production efficiency, reduces costs, and achieves high-precision, stable electrical connections with improved accuracy and impedance matching, suitable for high-speed semiconductor testing.
Implementation Method 1
generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein additive manufacturing comprises directly layering the conductive material on the probe guiding portion
Data Source
AI summary
A method for producing a probe card comprises the steps of: providing a carrier board, wherein a surface of the carrier board has at least one probe guiding portion; and generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein the additive manufacturing comprises directly layering the conductive material on the probe guiding portion.